Multi-Chip Inductor Signal Transmission Noise Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices that transmit electric signals between circuits with different potentials face challenges in reducing size and handling high-frequency signals, and suffer from noise interference due to close proximity of inductors used for inductive coupling.
Innovation Solution
A semiconductor device design featuring multiple inductors formed in multi-layer interconnect layers on separate chips, with specific inductors connected to transmitting and receiving circuits to maintain distance and prevent interference, utilizing bonding wires for signal transmission between chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two sets of inductors are formed on the same substrate for transmitting two kinds of electric signals, then signal transmission capability is improved, but device area increases and manufacturing complexity increases
Solution Approach 1:
The patent divides the inductor system into two separate substrates: the first substrate contains the first and second inductors, while the second substrate contains the third and fourth inductors. This segmentation allows each substrate to be smaller and simpler, while collectively achieving the capability to transmit two kinds of electric signals through the distributed inductor configuration.
2Area of stationary object
If two sets of inductors are placed close together for compact design, then device area is reduced, but noise interference increases due to inductor interference
Solution Approach 1:
By segmenting the inductors across two separate substrates, the patent physically separates the inductor sets, increasing the distance between them and reducing electromagnetic interference and noise while still achieving compact overall device design.
Solution Approach 2:
The patent utilizes the vertical dimension by stacking substrates, with the first inductors on the first substrate and the second inductors on the second substrate positioned above or below. This three-dimensional arrangement reduces planar interference while maintaining compact footprint.
3Area of stationary object
If inductors are placed close together for compact design, then device area is reduced, but signal reliability deteriorates due to generated noise
Solution Approach 1:
The patent segments the inductor configuration across two substrates, which physically separates potential noise sources and reduces electromagnetic interference, thereby improving signal reliability while maintaining compact device area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively transmits electric signals with reduced noise interference by increasing the distance between inductive coupling pairs, thereby enhancing signal integrity and preventing parasitic capacitance issues.
Implementation Method 1
The first inductor and the second inductor are formed in the first multi-layer interconnect layer and are disposed above one another. One of the first inductor and the second inductor is connected to one of the first transmitting circuit and the second transmitting circuit, and the other inductor is connected to the other receiving circuit of the first receiving circuit and the second receiving circuit
Implementation Method 2
The third inductor and the fourth inductor are formed in the second multi-layer interconnect layer and are disposed above one another. One of the third inductor and the fourth inductor is connected to the other transmitting circuit of the first transmitting circuit and the second transmitting circuit, and the other inductor is connected to the other receiving circuit of the first receiving circuit and the second receiving circuit
Implementation Method 3
first and second bonding wires that connect the first semiconductor chip and the second semiconductor chip
Data Source
AI summary
A first semiconductor chip includes a first inductor and a second inductor, and a second semiconductor chip includes a third inductor and a fourth inductor. The first inductor is connected to a first receiving circuit of the first semiconductor chip, and the second inductor is connected to a second transmitting circuit of the second semiconductor chip through a first bonding wire. The third inductor is connected to a second receiving circuit of the second semiconductor chip, and the fourth inductor is connected to a first transmitting circuit of the first semiconductor chip through a second bonding wire.