Multi-chip LED Package Segmentation for Heat and Efficiency
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Solution Overview
Problem
Conventional LED devices face issues with heat generation and reduced light emitting efficiency when high power is applied, leading to shorter lifespan and increased manufacturing costs due to the need for cooling mechanisms and limited surface light emission.
Innovation Solution
A multi-chip package design where multiple LED chips share a single wafer substrate and clad layers, connected through bonding pads and wiring patterns, allowing for efficient current distribution and reduced heat generation, with the option to turn on/off individual chips for optimized brightness and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high power is applied to a single LED chip to increase brightness, then light brightness increases, but light emitting efficiency decreases and heat generation increases
Solution Approach 1:
The patent divides a single high-power LED chip into multiple lower-power LED chips (e.g., three chips instead of one). Each chip operates at lower current levels (around 350mA each instead of 1A in a single chip), maintaining high light emitting efficiency while collectively providing the required brightness through additive light output from multiple chips.
2Illumination intensity
If high power is applied to a single LED chip to increase brightness, then light brightness increases, but heat generation increases requiring cooling mechanisms
Solution Approach 1:
By segmenting the light output requirement across multiple chips, each chip generates less heat individually. The distributed heat generation across multiple chips is easier to manage and dissipate compared to concentrated heat from a single high-power chip, reducing or eliminating the need for active cooling mechanisms like fans.
3Temperature
If cooling mechanisms are added to control heat from high power LEDs, then heat control improves, but device complexity and manufacturing cost increase
Solution Approach 1:
The segmentation of LED chips inherently reduces heat generation per chip, making passive heat dissipation sufficient without requiring active cooling components. This eliminates the need for cooling fans, heat sinks, and associated control systems, thereby simplifying the overall device structure and reducing manufacturing costs.
4Area of stationary object
If a single LED chip is used for lighting, then device structure is simple, but surface light emission capability is limited
Solution Approach 1:
Multiple LED chips are merged into a single package unit, allowing them to function collectively as one lighting element. This provides extended surface light emission area comparable to traditional lighting sources while maintaining a compact, integrated package structure that can replace point-source LEDs in various applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-chip package design enhances light emitting efficiency, reduces heat generation, and simplifies the LED device structure, enabling brighter and more reliable lighting with lower power consumption and extended lifespan, while also facilitating surface light emission.
Implementation Method 1
Light-emitting diodes (LED) have undergone significant developments since the early 1990s using nitride semiconductor thin-films
Data Source
AI summary
Provided is a multi-chip package light emitting diode (LED) device including a plurality of LED chips within a single package. The LED device may include a base substrate, a multi-chip package for a LED on the base substrate, and a light radiator surrounding the multi-chip package and radiating light emitted by the multi-chip package for a LED, wherein the multi-chip package for a LED may include a plurality of LED chips on a single wafer substrate.