Multi-chip Module Resin Encapsulation Substrate Elimination

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Solution Overview

Problem

The miniaturization of multi-chip modules is limited by the machining accuracy of supporting substrates such as interposers and lead frames, which restricts the integration of multiple chip parts into a compact form factor.

Innovation Solution

A multi-chip module configuration where chip parts are sealed in a resin with internal wiring, and an external connection terminal is exposed on the resin surface, eliminating the need for supporting substrates and allowing for advanced functions with fewer external terminals, enabling miniaturization beyond the limits of traditional machining accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If supporting substrates such as interposers and lead frames are used, then chip parts can be mounted and supported, but the miniaturization of the multi-chip module is limited by the machining accuracy of these substrates

Engineering Contradiction:

Improvesize of multi-chip moduleVSAvoidmachining accuracy of supporting substrate

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent removes the supporting substrate (interposer or lead frame) from the system entirely. Instead of mounting chips on a substrate, the chips are directly embedded in the sealing resin, extracting the substrate function and eliminating the machining accuracy limitation that constrained miniaturization.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the supporting function with the sealing resin. The resin simultaneously provides structural support for the chips and serves as the encapsulation medium, eliminating the need for a separate substrate and enabling smaller module dimensions.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If traditional multi-chip module structure with supporting substrate is used, then chip parts can be integrated, but the number of external connection terminals increases

Engineering Contradiction:

Improveintegration of multiple chip partsVSAvoidnumber of external connection terminals

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The sealing resin performs multiple functions simultaneously: it seals the chips, provides structural support, and serves as the mounting medium for external connection terminals. This multi-functionality reduces the need for separate components and simplifies the overall structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If supporting substrates are used for mounting chip parts, then chips can be securely mounted, but the manufacturing process becomes more complex

Engineering Contradiction:

Improvemounting security of chip partsVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The sealing resin directly supports and secures the chip parts without requiring an intermediate substrate. The resin itself performs the mounting function, simplifying the manufacturing process while maintaining secure chip attachment through its encapsulating properties.

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS10804190B2Multi-chip module and method for manufacturing same

Publication Date: 2020.10.13 ROHM CO LTD

AI summary

A multi-chip module includes a plurality of chip parts with each chip part having an electrode, a sealing resin for sealing the plurality of chip parts, and an external connection terminal secured to the sealing resin so as to be exposed from the outer surface of the sealing resin and electrically connected to the electrode of at least one of the chip parts.