Multi-Chip Package Structure with Segmented Circuit Boards
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Solution Overview
Problem
The challenge lies in enhancing the yield rate and reducing the manufacturing cost of package structures that integrate multiple active chips and circuit boards, while also optimizing the circuit layout to reduce the load on the redistribution circuit structure.
Innovation Solution
A package structure is designed with a redistribution circuit structure, multiple chips, and circuit boards, where the chips are electrically connected to the redistribution circuit structure, and conductive terminals are used to connect the circuit boards, allowing for a simplified manufacturing process and reduced costs by distributing the load across multiple circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple chips are integrated in a package structure, then functionality is enhanced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the package structure into multiple independent circuit boards (first circuit board, second circuit board, etc.), each capable of being manufactured and tested separately. This segmentation allows parallel manufacturing processes, reducing overall manufacturing complexity while maintaining the functionality of integrating multiple chips through the redistribution circuit structure that connects these modular boards.
2Adaptability or versatility
If multiple chips are integrated in a package structure, then functionality is enhanced, but manufacturing cost increases
Solution Approach 1:
By segmenting the package into multiple circuit boards that can be manufactured independently using standard PCB processes, the patent reduces manufacturing cost. Each board can be produced in parallel, and defects can be isolated to individual boards rather than requiring complete package re-manufacturing, thereby improving cost-effectiveness while maintaining multi-chip functionality.
3Manufacturing precision
If circuit layout is optimized, then quality is improved, but redistribution circuit structure load increases
Solution Approach 1:
The patent distributes the circuit load across multiple separate circuit boards rather than concentrating all connections on a single redistribution circuit structure. Each board handles a portion of the total circuit traffic, thereby reducing the mechanical and electrical load on any single redistribution structure while maintaining optimized circuit layout quality through careful design of each individual board.
Data Source
AI summary
A package structure including a redistribution circuit structure, a first chip, a second chip, a first circuit board, a second circuit board, and a plurality of conductive terminals is provided. The redistribution circuit structure has a first connection surface and a second connection surface opposite to the first connection surface. The first chip and the second chip are disposed on the first connection surface and are electrically connected to the redistribution circuit structure. The first circuit board and the second circuit board are disposed on the second connection surface and are electrically connected to the redistribution circuit structure. The conductive terminals are disposed on the first circuit board or the second circuit board. The conductive terminals are electrically connected to the first circuit board or the second circuit board. A manufacturing method of a package structure is also provided.