Multi-chip Package Support Protrusion for Deflection Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current multi-chip packages face challenges in reliability and manufacturing efficiency due to vertical stacking of semiconductor dies, which complicates failure mode testing and increases costs, as a single defect can cause entire package failure, and there is a need for robust designs that can withstand stresses and temperature cycles.
Innovation Solution
A multi-chip package system with a package substrate, a base semiconductor die, and interconnects encapsulated with a support protrusion formed by an encapsulant, providing mechanical support and reducing deflection during assembly, and using pre-tested Known Good Packages (KGP) to enhance reliability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vertically stacked semiconductor dies are used in multi-chip packages, then circuit density and integration are improved, but reliability and manufacturing complexity deteriorate due to difficulty in testing and determining failure modes
Solution Approach 1:
The invention segments the multi-chip package into separate pre-tested modules (KGP modules) that can be independently tested and validated before final assembly. Each module contains specific semiconductor dies stacked together and tested as a unit, allowing failure modes to be identified at the module level rather than requiring disassembly of the entire package. This segmentation enables reliable high-density integration while maintaining manufacturability through modular testing approaches.
2Adaptability or versatility
If vertically stacked semiconductor dies are used, then system integration is improved, but manufacturing cost and complexity increase due to difficulty in testing individual dies
Solution Approach 1:
The invention applies preliminary action by pre-testing and validating semiconductor die stacks as complete modules (Known Good Packages) before final package assembly. Each KGP module undergoes comprehensive testing including electrical functionality, thermal performance, and mechanical integrity while still in module form. This preliminary validation eliminates the need for complex post-assembly testing of individually stacked dies, significantly simplifying the manufacturing process while enabling sophisticated multi-chip integration.
3Productivity
If multiple semiconductor dies are arranged vertically or horizontally, then circuit density is improved, but package failure risk increases because one critical defect induces complete package failure
Solution Approach 1:
The invention segments the multi-chip system into multiple independent KGP modules, each containing pre-tested semiconductor die stacks. By testing and validating each module independently before final assembly, the system achieves high circuit density through vertical stacking while mitigating failure risk. If a defect occurs in one module, the segmentation allows for targeted replacement or repair without requiring complete package disassembly, thereby improving overall package failure resistance while maintaining high density.
4Length of moving object
If thin semiconductor packages are used, then miniaturization is improved, but mechanical support and stress resistance deteriorate
Solution Approach 1:
The invention employs composite material structures within the thin KGP modules, combining multiple semiconductor dies, interconnect layers, and encapsulation materials to achieve both thinness and mechanical strength. The modular composite structure allows for optimized material selection in each layer, providing adequate stress resistance and mechanical support despite reduced overall package thickness. The pre-validated modular construction ensures that mechanical integrity is maintained throughout the thin package design.
Data Source
AI summary
The present invention provides a multi-chip package system that includes: providing a package substrate; attaching a base semiconductor die to the package substrate; connecting an interconnect between the base semiconductor die and the package substrate; and encapsulating at least portions of the package substrate, the base semiconductor die, and the interconnect with an encapsulant defining a support protrusion adjacent to the interconnect and substantially perpendicular to the package substrate, a cavity bounded by the support protrusion, and a gap linking the cavity to the edge of the encapsulant.