Multi-Chip Module PCB Recess Mounting for Higher Bandwidth
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Solution Overview
Problem
Current High Performance Computing (HPC) systems with multiple independent cards or boards connected via cable wires suffer from limited bandwidth and performance, restricting their usage in high-frequency applications.
Innovation Solution
Integration of multiple package components into reconstructed wafers at the wafer level, bonded together to form a system-on-wafer package, with interconnect structures and electrical connectors for enhanced electrical connectivity, and a recessed Printed Circuit Board (PCB) for improved stability and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple independent cards or boards are connected through cable wires, then system assembly is simplified, but bandwidth and performance are limited
Solution Approach 1:
The patent merges multiple device dies onto a single substrate to form a multi-chip module, eliminating the need for cable wire connections between independent cards. This integration increases bandwidth and performance while maintaining manufacturing simplicity through standardized mounting processes.
Solution Approach 2:
The patent transitions from a distributed card-based architecture to an integrated module architecture, effectively changing the dimensional organization of components. Multiple device dies are arranged in a two-dimensional array on the substrate, enabling higher density and faster interconnections without increasing physical footprint.
2Ease of manufacture
If device dies are packaged individually and mounted on PCB, then manufacturing process is conventional, but integration level is low
Solution Approach 1:
The patent combines multiple device dies and their associated packaging structures onto a single substrate, creating a multi-chip module with high integration level. This approach maintains manufacturing feasibility by using conventional mounting processes while achieving advanced integration.
Solution Approach 2:
The patent segments the system into modular device dies that can be independently manufactured and then integrated onto the substrate. This segmentation allows for specialized fabrication processes for each die type while achieving high overall integration through the multi-chip module architecture.
3Ease of operation
If packages are mounted on surface of PCB, then assembly is straightforward, but package thickness increases
Solution Approach 1:
The patent embeds the multi-chip module into a recess formed in the PCB substrate, creating a nested structure where the module sits within the board thickness rather than adding to it. This nesting approach maintains a low overall profile while preserving straightforward assembly processes.
Solution Approach 2:
The patent transitions from surface-mount assembly that adds to the Z-direction thickness to a recessed mounting approach that utilizes the X-Y plane of the PCB. This dimensional reorganization allows the module to be integrated within the board footprint without increasing overall package thickness.
4Ease of manufacture
If conventional PCB assembly is used, then manufacturing is simple, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent nests the multi-chip module within a recess in the PCB, allowing thermal management structures to be integrated directly with the module. This nested configuration enables efficient heat pathways from the device dies through the substrate while maintaining manufacturing simplicity.
Solution Approach 2:
The patent introduces a thermal interface material or heat spreader as an intermediary between the device dies and the PCB substrate. This intermediary structure facilitates efficient heat transfer from the high-power device dies to the larger thermal mass of the PCB while maintaining straightforward manufacturing processes.
Data Source
AI summary
A method includes bonding a first package to a second package to form a third package. The first package is an Integrated Fan-Out (InFO) package including a plurality of package components, and an encapsulating material encapsulating the plurality of package components therein. The plurality of package components include device dies. The method further includes placing at least a portion of the third package into a recess in a Printed Circuit Board (PCB). The recess extends from a top surface of the PCB to an intermediate level between the top surface and a bottom surface of the PCB. Wire bonding is performed to electrically connect the third package to the PCB.