Multi-Chip Substrate Transfer Using Pseudo-Donor Tiles
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Solution Overview
Problem
The Smart Cut™ process for transferring layers between substrates is limited by size mismatch and material waste, particularly with expensive III-V semiconductor materials, leading to polishing inhomogeneities and excessive material consumption due to sparse paving on substrates.
Innovation Solution
A method involving a pseudo-donor substrate with blocks forming at least two chips, bonded to a receiving substrate, followed by mechano-chemical polishing and material removal to form chips, ensuring high coverage and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If sparse paving is used on the receiving substrate, then material waste is reduced, but polishing inhomogeneity increases
Solution Approach 1:
The patent divides the receiving substrate into multiple discrete paving stones arranged in a pattern, allowing selective placement of material blocks only where needed. This segmentation enables reduced material waste while maintaining polishing uniformity by ensuring adequate spacing and support between adjacent paving stones, preventing cloth deformation in hollow areas.
2Quantity of substance
If blocks are placed far apart on the pseudo-donor substrate, then material consumption is reduced, but polishing cloth deformation increases
Solution Approach 1:
The patent applies preliminary mechano-chemical polishing to the blocks while they are still mounted on the pseudo-donor substrate, before transfer to the receiving substrate. This preliminary action ensures uniform polishing heights are established while blocks are properly supported and spaced, preventing cloth deformation. After polishing, material is removed to create chips, and the blocks are transferred to the receiving substrate where they maintain their polished uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Minimizes polishing defects and material waste by increasing paving stone density and uniformity, allowing for efficient formation of small chips without further chemical polishing.
Implementation Method 1
a weakened zone is created by implanting atomic species into the donor substrate
Implementation Method 2
bonding the pseudo-donor substrate to the recipient substrate via the blocks
Implementation Method 3
at least one mechano-chemical polishing step of the blocks of the pseudo-donor substrate and/or the portions of blocks transferred onto the receiving substrate
Data Source
Figure 1~2
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AI summary
The invention relates to a method for producing a structure comprising at least two chips (p11, p12, p13, p14) on a receiving substrate (3), said method comprising: - the production of a pseudo-donor substrate (10) by placing at least one tile (P1, P2, P3) of at least one donor substrate (2) on a support substrate (1); - the bonding of said pseudo-donor substrate (10) onto a receiving substrate (3) via the tiles so that each tile at least partially covers at least two distinct zones of interest (Z1, Z2, Zn) of the receiving substrate (3); - the transfer of a portion (P'1, P'2, P'3) of said tiles (P1, P2, P3) onto the receiving substrate (3); - at least one step of mechanical-chemical polishing of the tiles (P1, P2, P3) of the pseudo-donor substrate and/or of those portions of the tiles that have been transferred onto the receiving substrate; - and after the at least one step of mechanical-chemical polishing, a removal of material from the tile portions (P'1, P'2, P'3) so as to divide each tile portion into at least two chips (p11, p12, p13, p14) each arranged on a respective zone of interest (Z1, Z2, Zn).