Multi-Chip Push-Up Handling for High-Aspect-Ratio Semiconductor Dies

The push-up mechanism is divided into multiple independent push-up members (first, second, third push-up members) that can operate at different stages. Each member corresponds to a specific push-up stage and can be independently controlled, allowing the system to handle chips with large aspect ratios by applying push-up forces at multiple discrete points rather than requiring a single complex jig structure.

The push-up members are designed to move independently in the vertical direction, with each member capable of moving between a lower position (where it does not contact the chip) and an upper position (where it contacts and pushes the chip). This dynamic configuration allows flexible adaptation to chips with large aspect ratios, as each push-up member can be positioned and controlled independently based on the specific chip geometry, eliminating the need for fixed complex jigs.

Each push-up member is designed with multi-functionality, serving as both a support structure and an actuating element. The first push-up member supports the chip during transfer, the second push-up member provides intermediate support, and the third push-up member completes the push-up action. This universal design allows a single member to perform multiple functions across different operational stages, reducing the need for separate specialized components and thereby managing device complexity while maintaining high throughput.

The push-up members are arranged in a nested configuration where the first, second, and third push-up members are positioned at different vertical levels and can operate in sequence. The structure allows inner members to be nested within or alongside outer members, with each member capable of independent movement. This nested arrangement enables simultaneous handling of multiple chips through a compact structure, achieving high throughput without proportionally increasing device complexity.