Multi-Chip Circuit Substrate With Side Circuits and Bridge Interconnect
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Solution Overview
Problem
Existing technologies face challenges in integrating multiple chips due to differences in micro bump dimensions, leading to poor assembling yield, and the complex through silicon via (TSV) process increases manufacturing costs.
Innovation Solution
A circuit substrate structure and manufacturing method that utilize a bridge element and side circuits to connect multiple chips, reducing manufacturing costs and improving assembling yield by ensuring good planarity and efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through silicon via (TSV) process is used to integrate multiple chips, then electrical connection between chips is achieved, but manufacturing costs increase due to process complexity
Solution Approach 1:
The patent introduces a bridge element as an intermediary component that connects multiple chips through their back surfaces. This bridge element includes a carrier substrate with conductive structures that facilitate electrical connections between chips without requiring complex TSV processes in each chip, thereby simplifying the overall manufacturing process while maintaining reliable electrical connectivity.
2Adaptability or versatility
If micro bumps with different dimensions are used on substrate and embedded interconnect bridge, then integration is achieved, but assembling yield decreases
Solution Approach 1:
The patent employs connection elements with substantially uniform dimensions across all chips and the bridge element. The bridge element includes conductive structures and connection elements that are designed to match in dimension and configuration, ensuring consistent bonding interfaces. This homogeneity in connection element dimensions across all components enables precise alignment and high-yield assembly while maintaining integration capability.
3Reliability
If side circuits are added to chip side surfaces, then electrical connection paths are created, but chip structure complexity increases
Solution Approach 1:
The patent extends electrical connection paths from the traditional planar chip surfaces into the third dimension by creating side circuits along the vertical side surfaces of chips. These side circuits include conductive structures that run along the chip edges and connect to the bridge element, providing additional dimensional pathways for electrical connectivity without significantly complicating the overall chip structure.
Data Source
AI summary
A circuit substrate structure includes a circuit substrate, at least two chips, and a bridge element. The circuit substrate has a first surface and a second surface opposite to each other. The chips are arranged in parallel on the first surface of the circuit substrate and electrically connected to the circuit substrate. The chips have active surfaces, back surfaces opposite to the active surfaces, and side surfaces connecting the active surfaces and the back surfaces. The chips include side circuits. The side circuits are arranged on the side surfaces and have first ends and second ends, the first ends extend to the active surfaces along the side surfaces, and the second ends extend to the back surfaces along the side surfaces. The bridge element is arranged on the back surfaces of the chips and electrically connected to the active surfaces of the chips through the side circuits.