Recessed Spacing Structure in Multi-Chip Packages to Prevent Warpage
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Solution Overview
Problem
Multi-chip packaging structures face fragility and failure due to warpage and deformation, especially in smaller volumes, leading to issues like delamination and chip cracking, as they become more complex and larger in size.
Innovation Solution
The electronic package features a recessed spacing structure between adjacent electronic elements, with conductive elements acting as external contacts and a heat dissipation element bonded onto the package, improving flexibility and compensating for thermal variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plurality of semiconductor chips are arranged on a substrate to increase I/O counts and computing power, then the packaging structure becomes more complex and larger in size, but the structure becomes more fragile and prone to warpage, delamination, and chip cracking
Solution Approach 1:
The patent introduces spacing structures between adjacent electronic elements that divide and separate the packaging structure into independent segments. These spacing structures prevent stress propagation across the entire package, reducing the risk of delamination and cracking while maintaining high I/O capacity through modular arrangement of chips.
Solution Approach 2:
The spacing structures are strategically positioned between adjacent electronic elements to provide localized stress relief and thermal management. This local quality enhancement addresses warpage and fragility issues at critical stress points without compromising the overall packaging density and I/O performance.
2Volume of moving object
If the packaging structure is implemented in a smaller volume to reduce size, then integration density increases, but the structure becomes more fragile and susceptible to deformation
Solution Approach 1:
The spacing structures are integrated within the existing packaging architecture, nesting stress-relief functionality within the compact volume. The spacing structures are positioned between chips and substrate, utilizing the existing inter-chip spacing to provide reinforcement without adding external volume, thus maintaining small package size while enhancing structural strength.
3Speed
If more semiconductor chips are packaged into a single structure to increase computing power, then signal transmission delay is reduced, but the packaging structure becomes more prone to failure under thermal and mechanical stress
Solution Approach 1:
The spacing structures serve as intermediary elements between adjacent electronic chips, providing mechanical isolation and thermal management. These intermediaries prevent stress concentration and heat buildup at chip interfaces, reducing the harmful effects of thermal and mechanical stress while maintaining the close-proximity arrangement needed for high-speed signal transmission.
Data Source
AI summary
An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.