Multi-chip stacked device redundancy for defect recovery
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Solution Overview
Problem
In multi-chip stacked devices, manufacturing defects can lead to defective chips being incorporated, resulting in reduced yield and operational failures, as existing technologies lack effective redundancy schemes to recover and reconfigure devices to meet alternative specifications.
Innovation Solution
A multi-chip device architecture with vertically stacked chips, where neighboring pairs are directly connected, allowing for configuration to operate a subset of functionality even if processing integrated circuits are defective, enabling recovery and reconfiguration to meet different device specifications by deactivating defective components and redistributing configuration data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If defective chips are identified and discarded before attachment, then manufacturing precision is improved, but productivity deteriorates due to reduced yield
Solution Approach 1:
The patent incorporates redundant chips into the multi-chip device structure before manufacturing is complete. These redundant chips serve as a buffer or cushion against potential defects, allowing the system to maintain functionality even if some chips are defective. The redundancy is built in advance (beforehand) to compensate for manufacturing imperfections without requiring complete discarding of defective units.
Solution Approach 2:
The patent enables dynamic reconfiguration of the multi-chip device by changing operational parameters. When defects are detected, the system changes its configuration state by activating different chip combinations or reassigning functional roles to available chips. This parameter change allows the device to adapt to manufacturing variations and continue production with modified specifications rather than complete rejection.
2Productivity
If defective chips are incorporated into multi-chip stacked devices, then productivity is improved by maintaining manufacturing flow, but reliability deteriorates due to operational failures
Solution Approach 1:
Redundant chips are incorporated into the device structure beforehand to cushion against the negative effects of defective chips. The redundancy acts as a safety buffer that allows the system to absorb manufacturing defects without complete failure, maintaining both productivity and reliability simultaneously.
Solution Approach 2:
The patent implements dynamic reconfiguration capabilities that allow the multi-chip device to adapt its operational state based on detected defects. The system can dynamically switch between different chip configurations, activate standby chips, or reassign functional roles during operation. This dynamic behavior enables the system to maintain reliability even when defective chips are incorporated, while preserving manufacturing throughput.
3Reliability
If redundant chips are incorporated into the device, then reliability is improved through defect recovery, but device complexity increases
Solution Approach 1:
The redundant chips are designed with universal functionality that allows them to perform multiple roles depending on configuration needs. Rather than having specialized backup chips for each specific function, the redundant chips can be configured to replace any defective chip through software control. This universality reduces the overall complexity compared to having dedicated backup components for each function.
Solution Approach 2:
The patent uses software-based reconfiguration to change operational parameters of the chip stack. Instead of requiring complex hardware switching mechanisms or physical reconfiguration, the system changes its state by loading different configuration data that activates appropriate chips and routes signals accordingly. This parameter-based approach simplifies the hardware complexity while maintaining high reliability through defect recovery.
Data Source
AI summary
Some examples described herein relate to redundancy in a multi-chip stacked device. An example described herein is a multi-chip device. The multi-chip device includes a chip stack including vertically stacked chips. Neighboring pairs of the chips are directly connected together. Each of two or more of the chips includes a processing integrated circuit. The chip stack is configurable to operate a subset of functionality of the processing integrated circuits of the two or more of the chips when any portion of the processing integrated circuits is defective.