Multi-Circuit Cooling System for Diverse Electronic Components
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Solution Overview
Problem
Existing cooling systems, particularly direct liquid cooling methods, are ineffective for non-flat electronic components and are costly for moderately dissipative components, limiting their applicability in data centers with diverse and shaped electronic components.
Innovation Solution
The proposed cooling system incorporates a tertiary-secondary exchanger and an air-tertiary exchanger to efficiently transfer heat from the tertiary liquid to the refrigerant fluid and from the air in the computer rack to the tertiary liquid, respectively, allowing for the cooling of varied and non-flat electronic components, including low dissipative ones, by enhancing the heat evacuation paths and using a secondary and tertiary circuit with dedicated loops and flow controllers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If direct liquid cooling method is used for flat electronic components, then cooling efficiency for highly dissipative components is improved, but applicability to non-flat components deteriorates
Solution Approach 1:
The cooling system is divided into multiple independent circuits (primary, secondary, tertiary) with different cooling methods, allowing each circuit to be optimized for specific component types while maintaining overall system versatility
Solution Approach 2:
The cooling system is designed to handle multiple cooling tasks simultaneously through different circuits: direct liquid cooling for high-dissipative flat components, air cooling for non-flat components, and indirect liquid cooling for moderately dissipative components, making the system universally applicable to diverse electronic components
2Temperature
If direct liquid cooling method is used, then cooling performance for highly dissipative components is improved, but cost for moderately dissipative components increases
Solution Approach 1:
Different cooling methods are applied to different regions/circuits based on local requirements: the primary circuit with direct liquid cooling is used where high cooling performance is needed, while the tertiary circuit with air cooling is used where lower cost is prioritized, optimizing the balance between performance and cost
3Adaptability or versatility
If multiple cooling circuits are added to handle diverse components, then adaptability to different component types is improved, but system complexity increases
Solution Approach 1:
The secondary circuit acts as an intermediary between the primary and tertiary circuits, with heat exchangers that enable heat transfer between circuits, allowing the system to switch between different cooling modes and reducing the need for completely independent cooling systems for each component type
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient cooling of both highly dissipative and low dissipative electronic components, reducing the size and cost of cooling systems while maintaining effective temperature regulation, allowing for increased computing power in compact data centers.
Implementation Method 1
a primary exchanger intended to transfer heat from first electronic components to the primary liquid
Implementation Method 2
a primary-secondary exchanger intended to transfer heat from the primary liquid to the refrigerant fluid
Implementation Method 3
a closed circuit, referred to as secondary circuit, of refrigerant fluid... in such a way that the refrigerant fluid changes state at least partially
Implementation Method 4
a secondary-tertiary exchanger intended to transfer heat from the refrigerant fluid to the tertiary liquid
Implementation Method 5
an air-tertiary exchanger intended to transfer, to the tertiary liquid, heat from the air of the computer rack heated by second electronic components
Implementation Method 6
a tertiary-thermal source exchanger intended to transfer heat from the tertiary liquid to a thermal source
Data Source
AI summary
A cooling system for the electronic components of a computer rack, including a primary circuit of primary liquid; a primary exchanger intended to transfer heat from first electronic components to the primary liquid; a secondary circuit of refrigerant fluid; a primary-secondary exchanger; a tertiary circuit of tertiary liquid; a secondary-tertiary exchanger; and a tertiary-thermal source exchanger. The cooling system also includes a tertiary-secondary exchanger; and an air-tertiary exchanger intended to transfer, to the tertiary liquid, heat from the air of the computer rack heated by second electronic components, the air-tertiary exchanger being arranged, in the tertiary circuit, downstream of the tertiary-secondary exchanger and upstream of the secondary-tertiary exchanger.