Multi-circuit heat pump
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Solution Overview
Problem
Existing heat pumps, especially for high-temperature applications, face challenges with low coefficient of performance (COP) due to high-pressure ratios between the evaporator and condenser, and require multiple units in a series counterflow arrangement, leading to increased cost and bulkiness.
Innovation Solution
A multi-circuit heat pump design featuring a single evaporator fluidically connected to multiple series-connected condensers, with compressor units and economizers configured between them, allowing independent operation of motors and temperature control, and utilizing either water-cooled or air-cooled condensers with multi- or single-pass heat exchangers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single unit with a single evaporator and condenser is used, then the structure is simple, but the coefficient of performance (COP) is low due to high-pressure ratio
Solution Approach 1:
The patent divides the single condenser into multiple condensers connected in series (first condenser, second condenser, etc.), with each condenser handling a portion of the temperature lift. This segmentation reduces the pressure ratio across each individual condenser, improving the overall COP while maintaining a relatively compact integrated structure through shared evaporator and compressor resources.
2Temperature
If multiple units in series counterflow arrangement are used, then the temperature lift requirement is met, but the cost increases
Solution Approach 1:
The patent merges multiple condenser stages into a single integrated heat pump unit, sharing common components such as the evaporator, compressor, and control systems. This consolidation achieves the required temperature lift through series-connected condensers while reducing overall system cost compared to using completely separate heat pump units.
3Temperature
If multiple units in series counterflow arrangement are used, then the temperature lift requirement is met, but the system becomes bulky
Solution Approach 1:
The patent nests multiple condenser stages within a single unit housing, with the first condenser, second condenser, and associated components arranged in a compact integrated configuration. This nesting approach reduces the overall system volume compared to using separate heat pump units while maintaining the series counterflow arrangement necessary for achieving the required temperature lift.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces pressure ratios, improves COP, and provides cost and space-saving advantages by using smaller condensers and compressor motors, while enabling efficient heating across varying temperature ranges.
Implementation Method 1
an evaporator, a plurality of condensers fluidically connected in series
Implementation Method 2
a plurality of compressor units configured between the evaporator and the plurality of condensers
Implementation Method 3
at least one of the plurality of condensers is a multi-pass heat exchanger; at least one of the plurality of condensers is a single-pass heat exchanger
Data Source
AI summary
A multi-circuit heat pump is disclosed. The heat pump comprises an evaporator, a plurality of condensers fluidically connected in series, and a plurality of compressor units configured between the evaporator and the plurality of condensers such that one of the compressor units is fluidically configured between the evaporator and one of the condensers.