Multi-class filler insertion for circuit layout ECOs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current circuit layout filling methods using a single type of filler are inefficient for engineering change orders (ECOs) and lack robustness in power supply, as they require changes to base layers, especially in metal ECOs, and do not allow for optimal decap distribution.
Innovation Solution
Classifying a set of filler classes, including standard cell fillers, decaps, and always-on decaps, and configuring a filler insertion pattern based on a required ratio to ensure horizontal and vertical density, allowing for multiple types of filler cells in each row to facilitate efficient ECOs and improved power supply robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single type of filler is used to fill gaps in circuit layout, then the layout is simple to implement, but engineering change order capability is lost and power supply robustness is reduced
Solution Approach 1:
The patent segments fillers into multiple classes (first filler class, second filler class, third filler class) with different functions and properties. This segmentation enables selective insertion of appropriate filler types in different regions, maintaining layout simplicity while enabling ECO capability and improving power supply robustness.
Solution Approach 2:
Different filler classes are inserted based on local design requirements and gap characteristics. The method determines filler insertion based on gap size, shape, and surrounding cell types, ensuring each region receives the most suitable filler type for its specific functional needs.
2Device complexity
If a single type of filler is used to fill gaps in circuit layout, then the implementation is straightforward, but power supply robustness and IR robustness are compromised
Solution Approach 1:
The patent divides fillers into multiple classes with different electrical and physical properties. First filler class provides basic filling, second filler class improves power supply robustness, and third filler class enhances IR robustness. This segmentation allows optimization of power supply characteristics without complicating the overall insertion method.
Solution Approach 2:
The method changes parameters such as filler type, insertion ratio, and distribution pattern to optimize power supply robustness and IR robustness. By adjusting these parameters based on gap characteristics and surrounding cells, the patent achieves improved reliability without significantly increasing implementation complexity.
3Adaptability or versatility
If multiple types of filler classes are inserted to support ECOs and improve power supply, then adaptability and reliability are improved, but the complexity of determining insertion patterns increases
Solution Approach 1:
The patent performs preliminary classification of gaps into different types based on size, shape, and location before determining filler insertion. This preliminary action simplifies the subsequent filler selection process by pre-establishing criteria for different filler classes, making the complex task of multi-type filler insertion more manageable and systematic.
Solution Approach 2:
The method incorporates feedback mechanisms where the determined filler insertion pattern is validated against design requirements and gap characteristics. This feedback loop ensures that the insertion pattern achieves the desired adaptability and reliability while maintaining reasonable complexity in the determination process.
4Manufacturing precision
If filler insertion is optimized for horizontal and vertical density ratio, then manufacturing precision and layout efficiency are improved, but the complexity of pattern identification increases
Solution Approach 1:
The patent applies partial action by focusing on achieving the required density ratio in critical regions rather than uniformly across the entire layout. This approach achieves manufacturing precision in key areas while simplifying the overall pattern identification process by prioritizing high-impact regions.
Solution Approach 2:
The method changes parameters such as filler insertion ratio, distribution pattern, and selection criteria to achieve the desired horizontal and vertical density ratio. By adjusting these parameters based on gap characteristics and design requirements, the patent achieves manufacturing precision without excessively complicating the pattern identification process.
Data Source
AI summary
A method for filler insertions in a circuit layout having a cell row of standard cells and gaps between the standard cells is disclosed. First, a set of filler classes, each filler class having a set of filler cells, is classified that are configured to fill the gaps depending on a design requirement. Then, a filler insertion pattern based on a required ratio is identified such that horizontal and vertical density of the set of filler classes in the circuit layout are as per the required ratio and the cell row of the circuit layout has at least one filler cell from each of the set of filler classes.