Multi-Cold Plate Cooling for Interleaved DIMMs
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Solution Overview
Problem
Conventional liquid cooling systems for computing devices face challenges in evenly distributing heat across high-performance components, particularly in systems with stacked printed circuit boards and interleaved memory modules, leading to potential overheating and reduced cooling efficiency.
Innovation Solution
The use of multiple cold plates with embedded flat heat pipes that are made of thermally conductive plastic, positioned in stacked or flipped orientations, to create a multi-directional cooling system that transfers heat from interleaved DIMMs to coolant channels, ensuring even heat distribution and redundancy in case of component failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling systems are used with stacked PCBs and interleaved memory modules, then the system can provide cooling capacity, but heat distribution becomes uneven leading to overheating in certain areas
Solution Approach 1:
The cooling system is divided into multiple cold plates (first cold plate, second cold plate) that are positioned at different locations to contact different memory modules. Each cold plate independently cools specific heat-generating components, segmenting the heat removal function to achieve more uniform heat distribution across the stacked PCB architecture.
Solution Approach 2:
Different regions of the cooling system are tailored to address local heat generation characteristics. The first cold plate contacts memory modules on one side while the second cold plate contacts memory modules on the opposite side, providing localized cooling quality matched to the thermal profile of each region.
2Reliability
If multiple cold plates are added to improve heat distribution, then cooling efficiency improves, but device complexity increases
Solution Approach 1:
Multiple cold plates are merged into a unified cooling system architecture where the first and second cold plates work together in a coordinated manner. The cold plates are integrated with the stacked PCB structure, merging the cooling function with the mechanical assembly to reduce overall system complexity despite adding cooling capacity.
Solution Approach 2:
The cold plates serve multiple functions: they provide thermal contact with memory modules, conduct heat away from multiple locations simultaneously, and can be positioned in various configurations (stacked or flipped orientations) to adapt to different thermal requirements. This multi-functionality justifies the added structural elements.
3Power
If stacked PCBs with interleaved DIMMs are used to increase computing performance, then processing power improves, but heat generation increases leading to overheating risks
Solution Approach 1:
The cooling system is nested within the stacked PCB architecture. The first and second cold plates are positioned to contact memory modules that are interleaved between the PCBs, creating a nested configuration where cooling components are integrated within the computational structure itself, allowing heat removal from high-performance components without increasing external footprint.
Solution Approach 2:
The cooling approach transitions from a single-plane cooling method to a multi-dimensional cooling architecture. By stacking cold plates in different orientations and positioning them on opposite sides of the interleaved memory modules, the system adds vertical and lateral dimensions to heat removal, effectively managing heat from high-power components in a compact three-dimensional arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances cooling efficiency and resilience by providing uniform heat dissipation across multiple DIMMs, reducing the risk of overheating and allowing for a compact design, even in high-performance computing environments.
Implementation Method 1
The plurality of cold plates can be made of thermally conductive plastic material that forms a plurality of coolant channels
Implementation Method 2
The liquid, such as water or coolant can transfer the heat away from components of the computing device
Data Source
AI summary
An example cooling system is described herein. The cooling system can include a first cold plate including a first heat pipe to couple to a side of a dual in-line memory module (DIMM) where the first heat pipe transfers heat from the DIMM to the first cold plate; and a second cold plate including a second heat pipe to couple to the side of the DIMM, where the second heat pipe transfers heat from the DIMM to the second cold plate.