Multi-Collet Chip Mounting for Large Semiconductor Handling
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Solution Overview
Problem
The diversification of electronic devices has led to varying semiconductor chip shapes, including rectangular parallelepipeds and thin plates, resulting in chips with different mechanical strengths. This diversity complicates handling, especially with the need for high-mix production and the challenge of picking up large chips without damaging them.
Innovation Solution
A mounting device with multiple direct-acting motors and a chip holder that can be attached to straddle the end portions of at least two movable elements. This configuration allows for two modes: one for larger chips with a larger chip holder driven by multiple motors, and another for smaller chips with individual chip holders attached to each motor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large collet is used to suck the entire surface of large semiconductor chips, then the damage to semiconductor chips is suppressed, but the weight of the collet increases and the thrust of the motor becomes insufficient
Solution Approach 1:
The invention divides the single large collet into multiple smaller collets (first collet and second collet). Each collet has reduced weight and can be independently driven by its own motor, while collectively they can hold the entire large semiconductor chip surface, solving both the damage suppression and motor thrust limitations.
Solution Approach 2:
Multiple collets are combined to work together on a single large semiconductor chip. The first and second collets can simultaneously hold different portions of the chip, achieving the effect of a large collet without the associated weight and motor thrust problems.
2Productivity
If a mounting device is specialized for handling specific components, then handling efficiency is improved, but the ability to handle various shapes of semiconductor chips is reduced
Solution Approach 1:
The mounting device is designed with multiple collets that can be selectively used based on chip size and shape requirements. The same device structure can handle both large and small semiconductor chips by adjusting which collets are activated, providing universal handling capability across different chip types.
Solution Approach 2:
The system dynamically selects and activates appropriate collets based on the specific chip being handled. This dynamic configuration allows the device to adapt its holding pattern to match different chip shapes and sizes while maintaining efficient handling operations.
3Area of moving object
If multiple motors are used to drive a large chip holder, then the area of the holding surface is increased, but the device complexity increases
Solution Approach 1:
Instead of using a single large chip holder driven by multiple motors, the invention segments the holding function into multiple independent collets. Each collet is driven by its own motor, simplifying the control architecture while achieving the same total holding surface area through distributed configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mounting device can efficiently handle semiconductor chips of various shapes and sizes by adjusting the chip holder size and attachment mode, ensuring reliable picking and placement without damage, and accommodating the need for high-mix production.
Implementation Method 1
a chip holder which is attached to an end portion side of the movable element and sucks and holds a semiconductor chip
Data Source
AI summary
A mounting device 1 is equipped with: two direct-acting voice coil motors 38 in which a movable element 38c reciprocatingly moves along an axis A relative to a fixed element 38b; and a collet 34A mounted on an end part side of the movable elements 38c, the collet 34A holding a semiconductor chip 101 by suction. The plurality of voice coil motors 38 are disposed so as to be set away from each other along a direction intersecting the axes A, and in a manner that the axes A are parallel to each other. The collet 34A is mounted so as to straddle chucks 39 provided at the end parts of the two movable elements 38c.