Simultaneous Multi-Color LED Transfer via Laser Oscillator
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Solution Overview
Problem
The manufacturing process of microLED display modules is inefficient due to performance differences between LEDs formed in various regions of a wafer, leading to non-uniform luminance and color across the display module, and the sequential transfer of LEDs from separate wafers increases the overall manufacturing time.
Innovation Solution
A method involving a transfer substrate with LEDs of different colors arranged in rows or columns, simultaneously transferred onto a target substrate using a laser oscillator, with a pressing member and thermal bonding to ensure uniform placement and bonding of LEDs, reducing the need for multiple wafer transfers and improving transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LEDs are transferred sequentially from separate wafers for each color, then the transfer process can be performed with dedicated wafers, but the LED transfer time is increased and total manufacturing time is increased
Solution Approach 1:
The patent combines multiple color LEDs (red, green, blue) onto a single wafer, creating a multi-color LED array. This allows all color LEDs to be transferred simultaneously in one operation rather than requiring separate transfer operations for each color, thereby reducing total transfer time while maintaining transfer accuracy through the unified transfer process
2Productivity
If LEDs are grown on different regions of the wafer, then all LEDs can be manufactured in one process, but performance differences occur between regions leading to non-uniform luminance and color
Solution Approach 1:
The patent divides the wafer into multiple distinct regions, with each region dedicated to growing a specific color LED (red, green, or blue). This segmentation ensures that LEDs of the same color are grown under identical conditions in their designated regions, eliminating performance variations that would occur if all colors were grown together, while still maintaining high manufacturing efficiency through batch processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the process time for transferring LEDs and enhances the uniformity of performance across the display module by allowing simultaneous transfer and uniform placement of LEDs, improving manufacturing efficiency and reducing the risk of damage to sensitive components.
Implementation Method 1
simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator
Implementation Method 2
The method includes bonding the plurality of LEDs to the target substrate using a thermal bonding method. The thermal bonding method comprises heating the target substrate with a heater, or heating the target substrate with an infrared laser
Data Source
AI summary
A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.