Multi-Column Charged Particle Optics for Stable High-Throughput Inspection
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Solution Overview
Problem
Current charged particle beam apparatuses for semiconductor IC chip manufacturing face challenges in achieving a combination of reduced brightness, total current, and current stability, which affects the detection and identification of micro-scale, nano-scale, and sub-nano-scale defects during the fabrication process, leading to reduced yield and throughput.
Innovation Solution
A charged particle beam apparatus with a plurality of charged particle-optical columns arranged in an array, featuring electrostatic objective lenses and selectable charged particle emitters, enhances the projection of charged particle beams onto a sample, improving brightness and stability through advanced electron optics and emitter selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single charged particle beam apparatus is used for inspection, then the device complexity is low, but the productivity and inspection throughput are insufficient for high-volume semiconductor manufacturing
Solution Approach 1:
The inspection system is segmented into multiple independent charged particle-optical columns, each capable of inspecting different regions of the substrate simultaneously. This parallel architecture increases throughput while keeping individual column complexity manageable.
Solution Approach 2:
Multiple charged particle-optical columns are merged into a single integrated inspection system with shared control and detection resources, achieving high throughput without proportionally increasing overall system complexity.
2Measurement precision
If the brightness of the charged particle beam is reduced, then the detection precision for micro-scale defects improves, but the total current and current stability deteriorate
Solution Approach 1:
The beam source is segmented into multiple independent emitters, allowing the total beam current to be distributed across many low-current beams. Each beam operates at low brightness for high precision, while the aggregate provides sufficient total current and stability.
Solution Approach 2:
The system changes the parameter of beam brightness by using multiple low-brightness emitters instead of a single high-brightness emitter, achieving both high measurement precision and adequate current stability through parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-resolution, high-throughput inspection and detection of defects, increasing the yield and efficiency of semiconductor manufacturing by improving the inspection apparatus's ability to handle complex patterns and reduce errors.
Implementation Method 1
the objective lens being an electrostatic objective lens
Implementation Method 2
a plurality of charged particle emitters configured to emit the charged particle beam towards the sample
Data Source
AI summary
The disclosure relates to a charged particle beam apparatus configured to project charged particle beams towards a sample. The charged particle beam apparatus comprises: a plurality of charged particle-optical columns configured to project respective charged particle beams towards the sample, wherein each charged particle-optical column comprises: a charged particle source configured to emit the charged particle beam towards the sample, the charged particle sources being comprised in a source array; an objective lens comprising an electrostatic electrode configured to direct the charged particle beam towards the sample; and a detector associated with the objective lens array, configured to detect signal charged particles emitted from the sample. The objective lens is the most down-beam element of the charged particle-optical column configured to affect the charged particle beam directed towards the sample.