High Density Multi-Component Modules via 3D Vertical Integration
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Solution Overview
Problem
Current systems for integrating multiple device components into a single package are inefficient due to decoupled design and thermophysical incompatibilities, resulting in larger and power-inefficient systems that fail to achieve maximum component density and power efficiency.
Innovation Solution
A method for forming high aspect ratio interconnecting structures within a matrix to integrate various subsystem components, including analog and digital circuits, sensors, and energy sources, on a single platform using nanoparticles to enhance material properties and performance, with functional interconnects between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are packaged into a single module, then component integration is improved, but component density and power efficiency are not optimized due to decoupled design
Solution Approach 1:
The system is divided into multiple functional layers (substrate layer, interconnect layer, component layer, encapsulant layer) that can be independently designed and fabricated, then assembled into a high-density three-dimensional module. This segmentation allows each layer to be optimized for its specific function while achieving overall high component density through vertical integration.
Solution Approach 2:
The patent transitions from traditional two-dimensional planar packaging to three-dimensional vertical integration by stacking multiple layers in the vertical dimension. High aspect ratio interconnects extend vertically through the module, enabling components to be arranged in three-dimensional space, thereby dramatically increasing component density beyond what is achievable with planar layouts.
2Ease of manufacture
If traditional packaging methods are used, then manufacturing simplicity is maintained, but system size increases and power efficiency decreases
Solution Approach 1:
Interconnect structures are formed in the substrate layer before components are attached, and encapsulant is applied to encapsulate components as they are placed. This preliminary preparation of interconnect pathways and encapsulation infrastructure simplifies the overall manufacturing process by establishing the structural framework beforehand, enabling efficient component placement and reducing assembly complexity despite the three-dimensional architecture.
3Ease of manufacture
If components are interconnected with traditional methods, then manufacturing ease is maintained, but thermophysical incompatibilities cannot be overcome
Solution Approach 1:
The substrate layer acts as an intermediary platform that provides a common foundation for mounting diverse components with different thermophysical properties. The substrate material is selected to have thermal and mechanical properties that are compatible with the various components, serving as a buffer that manages thermal expansion differences and stress distribution, thereby enabling reliable interconnection of heterogeneous components that would otherwise be incompatible.
Data Source
AI summary
A method for forming a device, comprising providing a first substrate carrying a first set of components disposed in a first encapsulating layer over the first set of components, providing a second substrate carrying a second set of components disposed in a second encapsulating layer over the second set of components, bonding the first and second substrates and functionally interconnecting at least one of the predefined components in the first set of components with at least one of the components in the second set of components.