High-Density Multi-Component Package Serial Connectivity
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Solution Overview
Problem
Existing electronic component packaging technologies face challenges in achieving serial connectivity while minimizing the footprint on circuit boards, as stacking components in parallel is limited and serial connections require additional space, contradicting the goal of miniaturization.
Innovation Solution
A high-density multi-component package using a combination of high-temperature conductive adhesives (HTCA) and high-temperature insulating adhesives (HTIA) between adjacent electronic components, allowing for serial and parallel connectivity, enabling compact packaging configurations both vertically and horizontally.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If components are stacked in parallel, then the footprint on circuit board is reduced, but serial connectivity cannot be achieved
Solution Approach 1:
The patent transitions from planar parallel stacking to three-dimensional vertical stacking with end-to-end terminations. By utilizing the vertical dimension and stacking components such that terminations connect end-to-end, the patent achieves serial connectivity while maintaining a compact footprint, as the connections extend in the vertical direction rather than requiring additional horizontal space.
Solution Approach 2:
The patent employs nested stacking where multiple components are vertically arranged with upper components positioned over lower components. The terminations are configured such that upper terminations connect to lower terminations in an end-to-end manner, creating a nested vertical structure that enables serial connectivity while minimizing the horizontal footprint.
2Adaptability or versatility
If components are connected serially by bonding terminals end-to-end, then serial connectivity is achieved, but the space required for mounting increases
Solution Approach 1:
The patent resolves the space increase issue by moving the serial connection arrangement from the horizontal plane to the vertical dimension. Components are stacked vertically with terminations connected end-to-end in the vertical direction, allowing serial connectivity to be achieved without increasing the horizontal mounting footprint on the circuit board.
Solution Approach 2:
The patent employs asymmetric vertical stacking arrangements where components are positioned at different heights and orientations. This asymmetric configuration allows terminations to connect end-to-end vertically while optimizing the use of vertical space, thereby achieving serial connectivity without requiring proportional increases in horizontal mounting area.
3Reliability
If high temperature conductive adhesive is used between adjacent terminations, then electrical connectivity is achieved, but electrical insulation between adjacent components is compromised
Solution Approach 1:
The patent applies different adhesive properties to different locations: conductive adhesive is applied locally between specific terminations that require electrical connection, while insulating adhesive is applied between adjacent components where electrical isolation is needed. This localized differentiation of adhesive properties enables both electrical connectivity and insulation to be achieved simultaneously in different regions of the assembly.
Solution Approach 2:
The patent segments the adhesive application into distinct functional zones: conductive adhesive segments connect electrical terminations that require connectivity, while insulating adhesive segments provide electrical isolation between adjacent components. This segmentation allows the system to simultaneously achieve both electrical connectivity and insulation by using appropriate adhesive types in appropriate locations.
4Object-generated harmful factors
If high temperature insulating adhesive is used between adjacent components, then electrical insulation is achieved, but mechanical bonding strength may be reduced
Solution Approach 1:
The patent applies insulating adhesive with appropriate mechanical properties to specific locations where electrical insulation is required between adjacent components. By selecting insulating adhesives with sufficient bond strength for the application and applying them only where insulation is needed, the patent achieves electrical isolation while maintaining adequate mechanical bonding strength for structural integrity.
Solution Approach 2:
The patent employs composite adhesive systems that combine insulating properties with mechanical bonding capabilities. These composite materials provide both electrical insulation and sufficient mechanical strength to bond adjacent components together, resolving the trade-off between insulation and bonding strength by integrating both functions into a single material system.
Data Source
AI summary
A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.