Multi-Component Plastic Molding With Rotatable Carrier-Block Cooling
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Solution Overview
Problem
Existing methods for manufacturing multi-component plastic molded parts suffer from inefficiencies such as prolonged cooling and removal times, requiring multiple inner half-molds and leading to thermal stresses and increased production costs.
Innovation Solution
A method involving a rotatable carrier block with inner half-molds that simultaneously cools and transports preforms and molded parts, using a cooling medium and handling means to reduce cycle times and ensure efficient production, while allowing for a single injection molding machine to perform multiple steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If preforms are cooled and removed separately after injection molding, then cooling and removal can be performed, but production cycle time is prolonged and thermal stresses increase
Solution Approach 1:
The patent combines cooling and removal operations into a single integrated process by implementing a rotatable carrier block that transports preforms through cooling zones and automatically removes them without separate handling steps, thereby reducing cycle time and minimizing thermal stress exposure
Solution Approach 2:
The patent applies preliminary cooling action by positioning cooling media (such as air streams or cooled surfaces) in advance along the carrier block rotation path, allowing preforms to begin cooling immediately after molding while being transported, rather than waiting for a separate cooling phase
2Productivity
If multiple inner half-molds are used for simultaneous injection molding, then production efficiency improves, but device complexity and manufacturing costs increase
Solution Approach 1:
The patent implements universality by designing a rotatable carrier block that serves multiple functions: it holds inner half-molds for injection molding, transports preforms through cooling zones, and facilitates removal of molded parts. This single multi-functional device replaces what would otherwise require multiple separate molding stations and handling systems
Solution Approach 2:
The patent applies dynamics by using a rotatable carrier block that dynamically repositions inner half-molds and preforms through rotation, allowing the same physical device to sequentially perform molding, cooling, and removal functions that would statically require multiple separate devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces cycle times, minimizes thermal stresses, and lowers production costs by enabling efficient, high-quality production of multi-component parts with controlled temperature distribution and automated handling.
Implementation Method 1
cooling the preform while carried by the inner half-mold on the carrier block by means of a cooling medium
Data Source
AI summary
A method is provided for manufacturing a multi-component plastic molded part and a tool system. The method comprises a first injection molding step for molding at least one preform, and a second injection molding step for molding at least one second component onto the preform. The first and second injection molding steps are performed with an injection molding machine comprising a first outer half-mold and at least one second outer half-mold positioned on opposite sides of a rotatable carrier-block. The carrier-block has at least four side faces each comprising an inner half-mold. The preform in the first injection molding step the second component in the second injection molding step are simultaneously injection molded. The injection molding machine is opened by moving the first and second outer half-mold spaced apart from the rotatable carrier-block. The preform is carried out of the first injection molding step, the plastic molded part is carried out of the second injection molding step by rotating the carrier-block. The preform is cooled while carried by the inner-half mold on the carrier-block by means of a cooling medium. The plastic molded part is removed from the inner-half mold on the carrier-block by means of a handling means.