Multi-Composition Thermal Interface Materials for Uneven Die Heights
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Solution Overview
Problem
In multi-die packages, ensuring sufficient thermal contact between semiconductor dies and a heat spreader is challenging due to manufacturing irregularities that result in varying die heights, leading to inefficient heat transfer.
Innovation Solution
The use of multiple thermal interface materials with different compositions, where one composition is more deformable than the other, allows the heat spreader to maintain contact with both dies by deforming to accommodate height differences and ensure effective thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single thermal interface material is used for all dies, then the device complexity is reduced, but the thermal contact reliability deteriorates due to manufacturing irregularities causing varying die heights
Solution Approach 1:
The patent divides the thermal interface material system into multiple segments, each with different compositions tailored to specific die height ranges. Instead of using a single uniform material across all dies, the solution segments the thermal interface materials into at least two different compositions, where each composition is optimized for accommodating dies within a particular height range. This segmentation allows each material to reliably accommodate its target die height range, thereby improving overall thermal contact reliability without requiring complex real-time adjustment mechanisms.
Solution Approach 2:
The patent applies local quality by assigning different material properties to different locations based on the specific die height requirements at each location. Each thermal interface material composition is selectively applied to dies with specific height characteristics, ensuring that the local material properties match the local geometric conditions. This approach allows the system to optimize thermal contact at each specific location rather than using a one-size-fits-all solution, thereby improving reliability while maintaining manageable device complexity through systematic material selection.
2Adaptability or versatility
If thermal interface material is made more deformable to accommodate height differences, then the adaptability improves, but the thermal conductivity may deteriorate due to material composition trade-offs
Solution Approach 1:
The patent employs parameter changes by systematically varying the composition, viscosity, and deformability parameters of thermal interface materials to match specific die height ranges. Each material composition is engineered with specific parameter values that optimize both adaptability to height variations and thermal conductivity within its target range. By changing material parameters rather than using a single material, the system achieves high adaptability without sacrificing thermal performance, as each material's parameters are optimized for its specific application context.
Solution Approach 2:
The patent utilizes composite materials by formulating thermal interface materials with multiple components that work together to achieve both deformability and thermal conductivity. Each thermal interface material composition is a carefully engineered composite designed to provide the necessary balance between adaptability to height variations and heat transfer efficiency. These composite materials allow the system to achieve both high adaptability and maintained thermal conductivity simultaneously, resolving the trade-off between these two critical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures reliable thermal contact and efficient heat transfer across semiconductor dies with varying heights, enhancing the thermal management of multi-die packages.
Implementation Method 1
a first composition is more deformable than a second composition under a first specified condition or conditions
Implementation Method 2
each of the plurality of semiconductor dies are in thermal contact with a heat spreader by a thermal interface material
Data Source
AI summary
A die package comprises a substrate comprising a first face and an opposing second face, a first semiconductor die coupled to the first face of the substrate, a second semiconductor die coupled to the first face of the substrate; and a heat spreader, wherein the first semiconductor die is thermally connected to the heat spreader by a first thermal interface material and the second semiconductor die is thermally connected to the heat spreader by a second thermal interface material, wherein the first thermal interface material comprises a first composition and the second thermal interface material comprises a second composition, wherein the first composition has a lower elastic modulus than the second composition under a first specified condition or conditions.