Multi-Connection Via Structure for High-Density PWB Interconnects
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Solution Overview
Problem
Conventional printed wiring boards (PWBs) face challenges in efficiently utilizing space due to the need for multiple vias, which consume valuable board space and are time-consuming and costly to manufacture, especially in high-component-density applications.
Innovation Solution
The implementation of a PWB with interconnect openings that have ledges, allowing multiple separate connections within a single opening, enabling diverse electrical interconnections and increasing component density without sacrificing space, by separating conductive traces into distinct groups with dedicated conductive layers for each group.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple conventional vias are used to make multiple electrical connections, then the number of electrical connections is satisfied, but the board space consumed increases dramatically
Solution Approach 1:
The patent combines multiple electrical connections into a single via structure by creating separate conductive regions within the same via opening. Each conductive region is electrically isolated from others but all connect to different conductive traces through the shared via opening, thereby reducing the total number of via openings needed while maintaining multiple electrical connections.
Solution Approach 2:
The via structure is segmented into multiple conductive regions within a single opening, where each region can independently connect to different traces. This segmentation allows one via to perform the function of multiple separate vias, reducing board space consumption while achieving the required number of electrical connections.
2Quantity of substance
If multiple conventional vias are used to achieve high component density, then the electrical connections are sufficient, but the manufacturing complexity and cost increase
Solution Approach 1:
By merging multiple connection functions into a single via opening with multiple conductive regions, the patent reduces the total number of drilling and plating operations required. This consolidation simplifies the manufacturing process and reduces costs while still achieving the necessary electrical connections for high component density.
3Quantity of substance
If conventional through-hole vias are used, then electrical connections are established, but routing of conductive traces on internal layers becomes difficult
Solution Approach 1:
The via is segmented into multiple conductive regions that can independently connect to different traces on various layers. This segmentation allows for flexible routing arrangements on internal layers, as each conductive region can be selectively connected to traces as needed, simplifying the overall trace routing complexity.
4Area of stationary object
If controlled depth via or buried via techniques are used to increase board space, then some interconnections are achieved, but the manufacturing time and cost increase significantly
Solution Approach 1:
The patent merges multiple connection functions into a single via opening that can be drilled and plated in one operation, unlike controlled depth or buried via techniques that require multiple separate operations. This approach increases board space efficiency while avoiding the time-consuming multi-step manufacturing processes associated with other techniques.
Data Source
AI summary
The present invention provides a PWB for attaching electrical components thereto. One aspect of the PWB includes multiple PWB insulating layers having conductive traces therebetween. The PWB has an interconnect opening located in the multiple PWB insulating layers that intersect at least a portion of the conductive traces. The interconnect opening has ledges therein, wherein each of the ledges separates a first group of the conductive traces from a second group of the conductive traces. The present invention also provides a method of making the PWB and also provides a power converter implementing the edge plate interconnects.