Multi-Core Interposer Stack-Up for Warpage-Resistant Scaling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing interposer substrates face challenges with scaling in size, leading to increased complexity, cost, and reliability issues due to material limitations such as warpage, cracking, and high manufacturing costs, particularly with glass and silicon substrates, while organic materials offer flexibility but lack thermal stability.
Innovation Solution
The use of interposer devices with multiple cores, each formed from different materials (e.g., glass, silicon, or organic) allows for a hybrid stack-up that reduces metallization levels and enables parallel fabrication, enhancing reliability and scalability by allowing early defect detection in smaller stacks before integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single large interposer substrate is used, then integration capacity increases, but warpage and cracking increase due to material limitations
Solution Approach 1:
The interposer substrate is divided into multiple smaller core substrates (first core substrate, second core substrate, etc.) that are stacked vertically. This segmentation allows each core to be manufactured independently with reduced warpage and cracking risks, while the overall integration capacity is maintained through the stacked configuration and interconnect structures that electrically connect the cores.
2Stability of the object's composition
If glass or silicon substrates are used, then thermal stability improves, but manufacturing cost and complexity increase
Solution Approach 1:
Different core substrates in the stack can be made from different materials optimized for their specific functions. For example, glass or silicon substrates can be used where thermal stability is critical, while organic substrates can be used in regions where flexibility and cost are more important. This local quality approach allows thermal stability to be provided only where needed, reducing overall manufacturing complexity and cost.
3Ease of manufacture
If organic materials are used for interposer substrate, then flexibility and ease of manufacture improve, but thermal stability deteriorates
Solution Approach 1:
The interposer device uses a composite structure with multiple core substrates made from different materials (glass, silicon, organic). This composite approach combines the manufacturing flexibility and cost benefits of organic materials with the thermal stability of glass and silicon substrates, creating an overall system that achieves both ease of manufacture and thermal stability through material diversity rather than relying on a single material's properties.
4Adaptability or versatility
If interposer size is scaled up, then integration capacity increases, but manufacturing cost and defect detection difficulty increase
Solution Approach 1:
The interposer is segmented into multiple smaller core substrates that can be manufactured independently at lower cost with easier defect detection. Each core can be fabricated, tested, and validated separately before being stacked and interconnected, significantly reducing the manufacturing cost and complexity compared to producing a single large interposer substrate, while still achieving high integration capacity through the stacked configuration.
Data Source
AI summary
Embodiments described herein relate interposer devices with multiple interposer cores. For example, a system can include a first stack of an interposer device and a second stack of the interposer device. The first stack can include a first core including a first core substrate and the second stack can include a second core including a second core substrate.