Multi-Coupler Power Wave Detection Across Multiple Reference Planes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices struggle to concurrently measure signal characteristics at multiple reference planes along a signal path, leading to impractical sequential measurements due to the dynamic nature of the signal, which hinders real-time performance characterization.
Innovation Solution
Implementing multi-coupler circuitry along the signal path with multiple signal couplers, each configured with different impedances to measure signals at distinct reference planes concurrently, allowing for simultaneous characterization of forward and reverse waves, impedances, and delivered powers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If sequential measurements are used to measure signal characteristics at multiple reference planes, then measurement complexity is reduced, but measurement time increases and real-time performance characterization is hindered
Solution Approach 1:
The measurement system is segmented into multiple independent signal couplers, each responsible for measuring signal characteristics at a specific reference plane. Each coupler includes its own power detector and impedance termination, allowing simultaneous independent measurements at different locations along the signal path without requiring sequential operation.
Solution Approach 2:
The patent transitions from temporal dimension (sequential measurements over time) to spatial dimension (simultaneous measurements at multiple locations). By placing multiple signal couplers at different reference planes along the signal path, the system achieves parallel measurement capability, effectively adding a spatial dimension to the measurement architecture.
2Adaptability or versatility
If multiple signal couplers with different impedances are used to measure at distinct reference planes, then measurement capability is improved, but device complexity increases
Solution Approach 1:
Each signal coupler is designed with specific local characteristics - different impedance values (e.g., 50 ohms, 75 ohms, 100 ohms) tailored to match the characteristic impedance at their respective reference planes. This local customization allows each coupler to accurately measure signal characteristics at its specific location while maintaining overall system compatibility.
Solution Approach 2:
Despite having different impedance values, all signal couplers share the same basic functional architecture and can perform identical measurement functions (power detection, impedance measurement, forward/reverse wave characterization). This universality allows a single design template to be replicated across multiple reference planes with only parameter adjustments, reducing overall design complexity.
3Reliability
If signal couplers are distributed between metallization layers on stacked dielectric substrate, then isolation between couplers is maximized, but manufacturing complexity increases
Solution Approach 1:
Multiple signal couplers are nested within a three-dimensional stacked dielectric substrate structure, with each coupler positioned in a separate metallization layer. The dielectric layers physically isolate the couplers from each other, providing excellent electromagnetic isolation while containing all components within a compact vertical footprint, similar to nested dolls.
Solution Approach 2:
The patent replaces traditional mechanical isolation methods (physical separation, shielding structures) with electromagnetic field-based isolation achieved through dielectric layers. The stacked dielectric substrate creates natural electromagnetic isolation between metallization layers, eliminating the need for complex mechanical isolation structures and simplifying manufacturing.
Data Source
AI summary
An electronic device may include signal transmission circuitry having a signal path and a signal source that transmits a signal on the signal path. First and second signal couplers may be coupled to the signal path. Control circuitry may use the first signal coupler to measure the signal at a first reference plane and may use the second signal coupler to concurrently measure the signal at a second reference plane. The signal measurements may include power wave, forward wave, reverse wave, impedance, and/or delivered power measurements. Terminations in the signal couplers may be adjusted to dynamically shift the reference planes. The first and second signal couplers may be formed from first and third metallization layers on a stacked dielectric substrate, where the signal path is formed from a second metallization layer. Additional signal couplers may be coupled to the signal path for concurrently measuring additional reference planes.