Multi-density wiring substrate for semiconductor packaging
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Solution Overview
Problem
The high cost of advanced semiconductor packaging technologies, such as those using silicon interposers and embedded bridge die connections, hinders their development due to the expensive materials and complex manufacturing processes involved.
Innovation Solution
A semiconductor package device with a substrate featuring low, middle, and high-density wiring structures, where the high-density and middle-density structures are electrically connected and arranged side by side, allowing for efficient electrical transmission across different bandwidths, and utilizing organic materials to reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon interposer structure or embedded bridge die is used for advanced semiconductor packaging, then electrical transmission performance and bandwidth are improved, but manufacturing cost increases significantly
Solution Approach 1:
The substrate is divided into multiple regions with different wiring densities (first region with first wiring pattern, second region with second wiring pattern). This segmentation allows each region to be optimized for specific functions - high-density regions for bandwidth-critical connections and low-density regions for cost-effective routing, thereby reducing overall manufacturing cost while maintaining electrical transmission performance.
Solution Approach 2:
Different wiring patterns are applied to different regions of the substrate based on local requirements. The first wiring pattern with smaller line width and spacing is used where high-density interconnection is needed, while the second wiring pattern with larger line width and spacing is used where cost reduction is prioritized. This local optimization resolves the contradiction between performance and cost.
2Productivity
If high-density wiring structure is used throughout the substrate, then electrical transmission capability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The substrate is segmented into multiple regions with different wiring densities. High-density wiring is implemented only in regions where it is necessary for electrical transmission capability, while low-density wiring is used in other regions. This reduces overall manufacturing complexity while maintaining the required electrical transmission capability in critical areas.
Solution Approach 2:
The wiring parameters (line width, spacing, density) are changed across different regions of the substrate. By varying these parameters locally rather than uniformly across the entire substrate, the patent achieves the required electrical transmission capability with reduced manufacturing complexity and cost.
Data Source
AI summary
A substrate, a semiconductor package device and a method of manufacturing a semiconductor device package are provided. The substrate includes a low density wiring structure, a first middle density wiring structure and high density wiring structure. The first middle density wiring structure is electrically connected to the low density wiring structure. The high density wiring structure is electrically connected to the low density wiring structure. The high density wiring structure and the first middle density wiring structure are disposed side by side. A line space of a circuit layer of the low density wiring structure is greater than a line space of a circuit layer of the first middle density wiring structure. The line space of the circuit layer of the first middle density wiring structure is greater than a line space of a circuit layer of the high density wiring structure.