Multi-Depth Cooling Channels for Semiconductor Heat Dissipation
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Solution Overview
Problem
The increasing miniaturization of power electronics in power converters poses challenges for heat dissipation in semiconductor arrangements, requiring effective and cost-efficient cooling solutions within limited space while maintaining high reliability and low manufacturing costs.
Innovation Solution
A method using Friction Stir Channeling (FSC) processes to create cooling channels at multiple depths in a metallic body, with connecting channels establishing fluid communication between them, allowing for complex internal circuits and improved heat dissipation, and using a metallic body with a flat surface for simpler and cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional cooling methods (milling, casting, forming) are used to create cooling channels, then cooling channels can be manufactured, but the manufacturing process becomes complex and costly due to multiple steps including opening grooves, closing them with brazing/welding/screwing, and connecting pipes separately
Solution Approach 1:
The manufacturing process is segmented into distinct FSC steps for creating different channel types (cooling channels at different depths and connecting channels), allowing each to be manufactured independently and then integrated, simplifying the overall process compared to conventional multi-step methods
Solution Approach 2:
The patent replaces conventional mechanical manufacturing methods (milling, casting, forming, brazing, welding, screwing) with Friction Stir Channeling (FSC), a friction-based process that directly creates closed cooling channels without requiring subsequent closing or connection steps, thereby eliminating process complexity
2Volume of moving object
If power electronics are miniaturized to reduce footprint, then space is reduced, but heat dissipation becomes more challenging due to limited cooling surface area and space
Solution Approach 1:
The patent transitions from single-level cooling channels to multi-level cooling channels at different depths within the metallic body, utilizing the vertical dimension to increase cooling surface area and heat dissipation capability without increasing the horizontal footprint of the device
Solution Approach 2:
Cooling channels are nested at multiple depths within the metallic body, with connecting channels linking channels at different levels, effectively nesting cooling functionality within a compact volume to maximize heat dissipation in a miniaturized device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation performance by creating a complex cooling channel structure with increased surface area contact, enabling efficient heat transfer and reduced manufacturing costs through flexible and cost-effective production methods.
Implementation Method 1
Friction Stir Channeling (FSC) processes
Implementation Method 2
Friction Stir Channeling (FSC) processes
Implementation Method 3
heat dissipation from the semiconductor arrangement
Implementation Method 4
cooling channels containing a heat transfer medium
Data Source
Figure 1
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AI summary
The invention relates to a method for manufacturing a device (2) for cooling a semiconductor arrangement. To provide a cost-effective and simple manufacturing method that enables improved heat dissipation from the semiconductor arrangement, the following steps are proposed: manufacturing a first cooling channel (20) using a first FSC process at a first depth (t1) in the metallic body (4); manufacturing a first connecting channel (22) using the first FSC process, which extends from the first cooling channel (20) to a surface (12), in particular a flat surface, of the metallic body (4); manufacturing a second cooling channel (24) using a second FSC process at a second depth (t2) in the metallic body (4), wherein the second depth (t2) is less than the first depth (t1).wherein a fluid connection is established between the first cooling channel (20) and the second cooling channel (24) via the first connecting channel (22), wherein a cooling channel structure (28) is formed by the cooling channels (20, 24) and the first connecting channel (22).