Multi-Depth LED Structure for Simultaneous RGB Transfer

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Solution Overview

Problem

The existing manufacturing process for LED devices is inefficient as it requires transferring LED structures emitting different colors sequentially, leading to low transfer efficiency.

Innovation Solution

The method involves creating grooves of varying depths on a substrate with integrated heterojunction structures, where light emitting layers of different colors are formed simultaneously in these grooves, and electrodes are connected through connection wires, allowing for synchronous transfer of multiple color-emitting units.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If LED structures emitting different colors are transferred sequentially during manufacturing, then each color can be transferred individually, but the transfer efficiency is low

Engineering Contradiction:
Improvetransfer efficiencyVSAvoidmanufacturing time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent combines multiple LED structures emitting different colors into a single integrated LED structure. Different colored LED units are arranged in different regions (first region, second region, third region) on the same substrate, allowing them to be transferred simultaneously as one unit, thereby improving transfer efficiency and reducing manufacturing time

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent uses spatial arrangement in different regions and depths on the substrate to differentiate multiple LED structures. By organizing LED units in first, second, and third regions with different depths, the system enables simultaneous transfer of multiple colors without sequential processing, resolving the efficiency bottleneck

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If only one LED structure emitting single color is transferred during a single transfer process, then the transfer process is simple, but the transfer efficiency is low

Engineering Contradiction:
Improvetransfer efficiencyVSAvoidstructure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

Multiple LED structures emitting different colors are merged into a single integrated structure on one substrate. This allows one transfer process to move multiple colored LED units simultaneously, improving productivity while the internal regional organization manages the complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated LED structure is segmented into different regions (first, second, third regions) with different depths, each containing LED units of specific colors. This segmentation allows for organized management and selective connection of different colored units while maintaining the benefit of simultaneous transfer

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12527142B2LED structures and manufacturing methods thereof, LED devices and manufacturing methods thereof
Publication Date: 2026.01.13 ENKRIS SEMICON (WUXI) LTD
  • US12527142B2 patent drawing
  • US12527142B2 patent drawing
  • US12527142B2 patent drawing

AI summary

The present disclosure provides LED structures and manufacturing methods thereof, LED devices and manufacturing methods thereof. The LED structure includes a substrate, light emitting units, first electrodes and second electrodes, and the substrate is provided with grooves with different depths. A light emitting unit is disposed in each of the grooves and includes a first semiconductor layer, a light emitting layer on the first semiconductor layer and a second semiconductor layer on the light emitting layer; light emitting layers in grooves with different depths emit different colors. A first electrode and a second electrode in each groove, the first electrode is electrically connected with the first semiconductor layer, and the second electrode is electrically connected with the second semiconductor layer.