Multi-Depth Shuttle Plate Pockets for Semiconductor Package Alignment
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Solution Overview
Problem
Conventional test handlers experience long conversion downtimes due to the need to change conversion kit components and realign hardware when handling different packaged semiconductor device sizes, which can take up to 3 hours, primarily because each device size requires its own shuttle plate and alignment adjustments.
Innovation Solution
The introduction of multi-package shuttle plates with pockets of varying depths and notches, allowing multiple package sizes to be seated on the same plate, eliminating the need for frequent hardware changes and realignments by self-aligning semiconductor devices during insertion and ensuring proper contact and alignment during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional shuttle plates with fixed pocket depths are used for each package size, then precise alignment and contact during testing is achieved, but conversion time increases significantly due to plate replacement and realignment
Solution Approach 1:
The shuttle plate incorporates multiple pockets with varying depths that can dynamically adapt to different package sizes. Each pocket contains a movable bottom or adjustable seating surface that shifts position based on the inserted package dimensions, allowing a single plate to maintain precise alignment for multiple package types without physical replacement or realignment operations
Solution Approach 2:
The invention changes the depth parameter of the pockets to accommodate different package sizes. By providing pockets with multiple depth levels or adjustable depth mechanisms, the system maintains optimal contact and alignment parameters for various package thicknesses and sizes using the same shuttle plate, thereby eliminating conversion downtime
2Manufacturing precision
If multiple conversion kit components are changed for different package sizes, then proper contact and alignment during testing is ensured, but hardware complexity and acquisition costs increase
Solution Approach 1:
The shuttle plate is designed as a universal component with pockets that can accommodate multiple package sizes through varying depths. This multi-functional design eliminates the need for multiple specialized shuttle plates and conversion kits, reducing hardware complexity while maintaining proper contact and alignment capabilities across different package types
Solution Approach 2:
The shuttle plate is segmented into multiple independent pockets, each capable of being configured for different package sizes. This segmentation allows each pocket to be independently adjusted or designed with variable depth characteristics, enabling the entire plate to handle diverse packages without requiring complete kit replacements
3Measurement precision
If re-alignment procedures are performed during package conversions, then testing accuracy is maintained, but productivity decreases due to extended conversion downtime
Solution Approach 1:
The shuttle plate is pre-configured with multiple pockets of varying depths during manufacturing, preparing it in advance to accommodate different package sizes. This preliminary configuration eliminates the need for realignment procedures during conversions, as the appropriate pocket depth is already established, thereby maintaining testing accuracy while improving conversion speed and productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces conversion time by allowing a single shuttle plate to accommodate various device sizes, cutting down conversion time by approximately 1 hour and enhancing productivity, while also reducing hardware acquisition costs and handling complexity.
Implementation Method 1
A sloped sidewall can realize a funnel type (widest top with inward sloping sides) pocket design that allows the package semiconductor devices to settle inside the pocket and self align upon insertion into the pocket.
Data Source
AI summary
An input/output shuttle plate includes a metal plate having a plurality of pockets. The plurality of pockets have a bottom, a sidewall portion and a pocket depth. A first seating surface at a first pocket depth (d3) is for supporting a first packaged semiconductor device having a first package size, and at least a second seating surface at a second pocket depth (d4) is for supporting a second packaged semiconductor device having a second package size. The first pocket depth is less than the second pocket depth (d3<d4), and the first package size is larger than the second package size. The shuttle plate is adapted to be fit on a test handler, such as by shuttle plate clips.