Multi-Detector Electron Beam Inspection Vacuum Chamber
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Solution Overview
Problem
Conventional inspecting apparatuses require significant time and effort to switch between electron and optical detectors, leading to inefficiencies in defect inspection due to the need for vacuum chamber opening, alignment adjustments, and potential for image quality degradation.
Innovation Solution
An inspecting apparatus with multiple detectors, including EB-CCD and EB-TDI sensors, disposed within the same vacuum chamber, allowing for seamless switching and optimization of signal detection based on signal strength and S/N ratio without breaking the vacuum, thereby reducing setup time and maintaining high image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If detector switching is performed by opening the vacuum chamber and replacing components, then detector adaptability is improved, but inspection time and productivity deteriorate
Solution Approach 1:
The patent combines multiple detector types (CCD detector and TDI detector) within a single vacuum chamber, allowing both detectors to operate simultaneously without requiring chamber opening for switching. This merging approach enables rapid detector selection while maintaining vacuum integrity, thereby improving both adaptability and productivity.
Solution Approach 2:
The patent implements a dynamic detector switching mechanism where the system can rapidly switch between CCD and TDI detectors based on inspection requirements without breaking vacuum. This dynamic switching capability eliminates the time-consuming manual replacement process while maintaining full detector functionality.
2Reliability
If CCD detector is used for adjusting incident conditions, then detector reliability is improved, but inspection speed and productivity worsen
Solution Approach 1:
The patent implements dynamic detector selection based on inspection stage requirements. The CCD detector is used for reliable incident condition adjustment during setup, while the TDI detector is switched to for high-speed inspection operations. This dynamic switching allows the system to optimize for either reliability or speed depending on the operational phase.
Solution Approach 2:
The patent segments the inspection process into distinct phases: a setup phase using the CCD detector for reliable condition adjustment, and an inspection phase using the TDI detector for high-speed operation. This segmentation allows each detector to be optimized for its specific function while maintaining overall system productivity.
3Adaptability or versatility
If vacuum chamber is opened for detector replacement, then detector adaptability is improved, but surface contamination and oxidation worsen
Solution Approach 1:
The patent merges multiple detector types within a single sealed vacuum chamber, eliminating the need to open the chamber for detector switching. This approach maintains vacuum integrity throughout the inspection process, preventing surface oxidation and contamination while providing full detector adaptability.
Solution Approach 2:
The patent maintains a vacuum (inert) environment within the chamber during detector operation and switching. By keeping the chamber sealed and maintaining vacuum conditions during detector transitions, the system prevents atmospheric contamination and oxidation of the inspected sample surface.
4Measurement precision
If manual alignment adjustments are performed during detector switching, then measurement precision is improved, but setup time and productivity worsen
Solution Approach 1:
The patent performs preliminary alignment setup using the CCD detector before switching to the TDI detector for high-speed inspection. By completing precise alignment adjustments during the setup phase with the CCD detector, the system eliminates the need for time-consuming realignment during subsequent TDI detector operations.
Solution Approach 2:
The patent implements a dynamic workflow where alignment-critical operations are performed with the CCD detector during setup, followed by rapid switching to the TDI detector for inspection. This dynamic approach allows precise alignment to be established once, then maintained during high-speed inspection without repeated adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and accurate defect inspection with reduced setup time, improved image quality, and prevention of surface oxidation and contamination, allowing for high-throughput semiconductor device manufacturing.
Implementation Method 1
a sample to be inspected is irradiated with an electron beam
Implementation Method 2
Detector and inspecting apparatus... detector for capturing electron beams or optical signals
Data Source
AI summary
An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors 11, 12for receiving an electron beam emitted from a sample W to capture image data representative of the sample W, and a switching mechanism M for causing the electron beam to be incident on one of the plurality of detectors 11, 12, where the plurality of detectors 11, 12 are disposed in the same chamber MC. The plurality of detectors 11, 12 can be an arbitrary combination of a detector comprising an electron sensor for converting an electron beam into an electric signal with a detector comprising an optical sensor for converting an electron beam into light and converting the light into an electric signal. The switching mechanism M may be a mechanical moving mechanism or an electron beam deflector.