Multi-Device Package Structure With Fine-Pitch Thermal Interconnects
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Solution Overview
Problem
There is a need for packages with improved performance, reduced size, and enhanced thermal and electrical connectivity, while also addressing the challenges of integrating multiple devices efficiently.
Innovation Solution
A package comprising a base substrate, integrated devices coupled through bonding materials, a fill material encapsulating the devices, and a metallization portion with fine pitch interconnects, utilizing inorganic materials for improved thermal performance and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple integrated devices are integrated onto a base substrate, then device functionality and performance are improved, but package size and fabrication complexity increase
Solution Approach 1:
The package is divided into distinct components: base substrate, integrated devices, bonding materials, fill material, and metallization portions. This segmentation allows each component to be optimized and fabricated separately using specialized processes, then assembled into the final package, thereby managing fabrication complexity while maintaining high device functionality.
Solution Approach 2:
Multiple integrated devices are mounted onto the base substrate in a nested arrangement, with devices positioned in available substrate areas. The fill material then nests around the integrated devices to occupy remaining spaces. This nested configuration maximizes device integration density without proportionally increasing package footprint, addressing the complexity-functionality tradeoff.
2Temperature
If inorganic materials are used for bonding and fill, then thermal performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent specifies that bonding materials and fill materials are composed of inorganic materials with controlled compositional parameters (e.g., glass composition ranges). By controlling material parameters within specified ranges, the patent achieves improved thermal performance while maintaining compatibility with existing manufacturing processes, thus balancing thermal enhancement with ease of manufacture.
3Reliability
If fine pitch interconnects are implemented, then electrical connectivity is improved, but fabrication precision requirements increase
Solution Approach 1:
The metallization portions extend in multiple dimensions, forming three-dimensional conductive structures that connect integrated devices. This multi-dimensional metallization approach provides redundant electrical pathways and improves connectivity reliability while distributing the precision requirements across multiple fabrication layers rather than demanding extreme precision in a single layer.
Data Source
AI summary
A package comprising a base substrate; a first integrated device coupled to the base substrate through a bonding material; a second integrated device coupled to the base substrate through the bonding material; a fill material coupled to the base substrate, the first integrated device and the second integrated device; and a metallization portion coupled to the first integrated device and the second integrated device.