Multi-device substrate inspection using golden die mapping
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Solution Overview
Problem
Conventional inspection methods for multi-device substrates are inefficient and impractical due to the need to scan and analyze multiple devices separately, leading to increased time and complexity, especially when compared to single-device substrates.
Innovation Solution
An automated optical inspection system that treats each block of multiple devices as a single device, using a golden die template to map defects and generate an indication of affected devices, allowing for a single scan to identify defects across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional inspection methods scan and analyze multiple devices separately, then measurement precision can be maintained, but inspection time and system complexity increase significantly
Solution Approach 1:
The patent merges multiple device inspections into a single unified inspection process. Instead of scanning each device separately, the system performs one scan of the entire multi-device substrate and then analyzes the image to identify defects across all devices simultaneously, dramatically reducing inspection time while maintaining accuracy through comprehensive image analysis
Solution Approach 2:
The inspection system is designed to handle multiple device types and configurations within a single inspection workflow. The system can accommodate varying device pitches, orientations, and positions on the substrate while using a unified inspection and analysis approach, making the system universally applicable to different multi-device substrate configurations
2Measurement precision
If conventional inspection methods scan multiple devices separately, then analysis accuracy can be maintained, but device complexity and setup overhead increase
Solution Approach 1:
The patent combines multiple inspection operations into a single unified process. The system performs one image capture of the entire substrate and then uses computational analysis to identify defects across all devices, eliminating the need for multiple separate scanning operations and reducing system complexity
Solution Approach 2:
The system creates a digital copy (image) of the entire substrate and performs analysis on this copy rather than physically scanning each device separately. This digital copying approach simplifies the inspection process while maintaining the ability to accurately identify and characterize defects in each device
3Loss of time
If a single scan is used to inspect multi-device substrates, then inspection time is reduced, but positioning accuracy and device pitch consistency become problematic
Solution Approach 1:
The patent replaces mechanical scanning operations with a single image capture followed by computational analysis. Instead of physically scanning each device position separately, the system captures one image and uses algorithms to locate and analyze defects at different positions, substituting mechanical precision requirements with computational methods that can handle variations in device pitch and positioning
Data Source
AI summary
A computing system receives, from an inspection device, an image of a multi-device substrate having one or more regions. Each region of the one or more regions having a plurality of devices formed thereon. The computing system identifies a golden die corresponding to the multi-device substrate. The golden die represents a canonical design of devices formed on the multi-device substrate. The computing system analyzes the image to identify defects in the image of the multi-device substrate by comparing the image of the multi-device substrate to the golden die. The computing system maps locations of the identified defects to corresponding locations on the golden die. The computing system, based on the mapping, determines, by the computing system, one or more devices of the plurality of devices affected by the defects. The computing system generates, as output, an indication of the defects and the one or more devices affected by the defects.