Multi-Diameter Laser Drilled Bore for Component Carrier
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Solution Overview
Problem
Conventional component carriers face challenges in achieving a balance between small laser via connection diameters required for tight design and larger via open diameters needed for reliable plating performance, while also ensuring effective heat transfer.
Innovation Solution
A component carrier with a bore structure featuring a first bore section with a larger diameter and a second bore section with a smaller diameter, both formed by laser drilling, and filled with a thermally conductive material like copper, which allows for precise registration and improved plating capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the laser via connection diameter is reduced to achieve tight design requirements, then the connection pad size is reduced and more components can be placed, but the plating reliability deteriorates and plating defects increase
Solution Approach 1:
The via structure is segmented into two distinct sections: a first via section with a larger diameter for reliable plating and heat transfer, and a second via section with a smaller diameter for precise connection pad alignment. This segmentation allows each section to optimize for its specific function without compromise
Solution Approach 2:
Different sections of the via have different diameters tailored to their specific functional requirements. The first section has larger diameter for plating reliability and heat transfer, while the second section has smaller diameter for precise pad registration, creating local quality variations throughout the via structure
2Quantity of substance
If the laser via diameter is reduced to increase via density in limited area, then more electronic components can be installed, but the heat transfer capacity deteriorates
Solution Approach 1:
The via is divided into sections with different diameters, where the first section provides enhanced heat transfer capacity through its larger cross-sectional area, while the second section enables higher via density through its smaller diameter
Solution Approach 2:
The via structure implements local quality by having a larger diameter in the first section for heat transfer optimization and a smaller diameter in the second section for density optimization, allowing simultaneous achievement of high density and effective heat management
3Measurement precision
If the via opening diameter is reduced to avoid mis-registration, then the alignment precision is improved, but the plating defects increase due to higher aspect ratio
Solution Approach 1:
The via structure is segmented into a first section with larger diameter for plating process optimization (lower aspect ratio) and a second section with smaller diameter for precise alignment, resolving the conflict between plating quality and alignment precision
Solution Approach 2:
The via diameter is changed along its length rather than maintaining a uniform diameter, creating a dimensional variation that allows optimization of both plating conditions and alignment precision at different positions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a small target pad size for precise registration while maintaining a larger heat transfer area, reducing the risk of plating defects and enhancing the reliability and heat management of the component carrier.
Implementation Method 1
the bore may be in particular formed by laser drilling
Implementation Method 2
a thermally conductive material filling substantially the entire bore
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The present invention relates to a component carrier (100) comprising a layer stack (101) formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore (110) extends into the layer stack (101) and has a first bore section (111) with a first diameter (D1) and a connected second bore section (112) with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material (102) fills substantially the entire bore (110). The bore is in particular formed by laser drilling.