Multi-Die Package Structure With Air-Gap Thermal Isolation
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Solution Overview
Problem
Current thermal management solutions in multi-chip modules and 3D packages fail to effectively reduce thermal crosstalk between dies with differing power consumption and junction temperature specifications, leading to inefficient heat dissipation.
Innovation Solution
A package structure is introduced with structural members and air gaps between dies, along with separate heat sinks for each die, to prevent direct thermal contact and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a heat dissipation structure is disposed above multiple dies to share heat dissipation resources, then device complexity is reduced, but heat dissipation efficiency deteriorates due to thermal crosstalk between dies with different power consumption and junction temperature specifications
Solution Approach 1:
The patent divides the shared heat dissipation structure into multiple independent heat dissipation structures, with each structure corresponding to a specific die. This segmentation allows each die to have dedicated heat dissipation resources, eliminating thermal crosstalk between dies with different thermal characteristics while maintaining manageable device complexity through modular design.
Solution Approach 2:
The patent implements localized heat dissipation structures that are specifically tailored to the thermal requirements of each individual die. Each heat dissipation structure is positioned directly above its corresponding die and can be independently optimized based on that die's power consumption and junction temperature specifications, rather than using a uniform shared structure.
2Loss of energy
If metal protection lid and thermal interface material are removed to reduce package thermal resistance, then heat dissipation efficiency improves, but thermal crosstalk between dies persists and heat dissipation effect remains suboptimal
Solution Approach 1:
The patent introduces separate heat dissipation structures for each die, physically segmenting the heat dissipation paths. This segmentation creates independent thermal zones above each die, preventing thermal crosstalk while maintaining low package thermal resistance through direct thermal contact between each die and its dedicated heat dissipation structure.
Solution Approach 2:
The patent uses dedicated heat dissipation structures as intermediaries between each die and the external environment. These intermediary structures provide direct thermal coupling to each die individually, serving as localized heat transfer pathways that eliminate the need for shared thermal interface materials while preventing thermal interference between adjacent dies.
3Adaptability or versatility
If multiple dies are integrated in a multi-chip module or 2.5D package form, then device functionality is enhanced, but thermal crosstalk between dies increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent applies segmentation by providing dedicated heat dissipation structures for each die within the multi-chip module or 2.5D package. This segmentation creates independent thermal management zones that allow multiple dies to be integrated closely for enhanced functionality while preventing thermal interference through separate heat dissipation pathways for each die.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure reduces thermal crosstalk and improves heat dissipation efficiency by isolating heat transfer paths between dies, optimizing thermal management.
Implementation Method 1
there is an air gap between the first structural member and the second structural member
Implementation Method 2
the first structural member may assist the first die in heat dissipation, and the second structural member may assist the second die in heat dissipation
Data Source
Figure 1~3
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Figure 6~7
AI summary
Embodiments of this application provide a package, a chip, and an electronic apparatus. The package includes a substrate, and a first die, a second die, a first structural member, and a second structural member that are disposed on the substrate. A first dielectric material is disposed between the first die and the second die. The first structural member is disposed on a side that is of the first die and that is away from the substrate, and the first die is located in a region of orthographic projection of the first structural member on a surface of the substrate. The second structural member is disposed on a side that is of the second die and that is away from the substrate, the second die is located in a region of orthographic projection of the second structural member on the surface of the substrate, and there is an air gap between the first structural member and the second structural member. The first structural member and the second structural member in the package may respectively assist the first die and the second die in heat dissipation. Because the first die and the second die are neither directly connected nor in direct contact, and the first structural member and the second structural member are neither directly connected nor in direct contact, impact of thermal crosstalk between the dies can be reduced, and heat dissipation effect can be improved.