Multi-Die Alignment Structures for Precise Wafer-Level Packaging
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Solution Overview
Problem
The semiconductor industry lacks a standard method for multi die Wafer level packaging (MDWLP) that addresses poor die registration and limited wiring density due to poor die registration, which occurs during the combination of dies on a substrate.
Innovation Solution
A semiconductor structure and method utilizing alignment structures, such as holes and spikes, are employed to align and attach dies to a substrate, ensuring precise matching of die and substrate alignment features through crystallographic etching and customized etch processes to form tetragonal pyramids and spikes, facilitating efficient die registration and uniform wiring density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging techniques are used where wafers are diced into individual chips before packaging, then each chip can be packaged separately with protective layers and electrical connections, but the size of individual chips cannot be further reduced and manufacturing process is more complex
Solution Approach 1:
The patent segments the wafer into multiple dies that are packaged together as a unit rather than individually. Multiple dies are mounted on a single substrate with shared protective layers and electrical connections, dividing the packaging process into manageable units while maintaining miniaturization benefits.
Solution Approach 2:
The patent merges multiple dies onto a single substrate with common packaging components. Instead of packaging each die separately, multiple dies share protective layers, electrical connections, and mounting structures, reducing overall package size and streamlining the manufacturing process.
2Manufacturing precision
If dies are combined on a substrate without precise alignment structures, then the packaging process is simpler, but poor die registration occurs leading to limited wiring density
Solution Approach 1:
The patent introduces alignment structures as intermediary features between dies and substrate. These structures include alignment marks, registration features, and positioning elements that mediate the alignment process, ensuring precise die registration without requiring complex adjustment mechanisms.
Solution Approach 2:
The patent replaces mechanical alignment adjustment systems with etched alignment structures formed through crystallographic etching processes. Instead of using mechanical positioning devices, the alignment is achieved through precisely etched features that guide die placement, simplifying the overall system while maintaining high precision.
3Productivity
If non-uniform wiring density is accepted due to poor die registration, then manufacturing is easier, but chip functionality and performance are limited
Solution Approach 1:
The patent incorporates alignment marks and registration features that provide feedback during the die mounting process. These features enable real-time verification of die position and orientation, allowing for adjustments that ensure uniform wiring density across all dies while maintaining manufacturing efficiency.
Solution Approach 2:
The patent utilizes crystallographic etching to create alignment structures with precise geometric parameters. By controlling etch depth, angle, and pattern, the alignment features are optimized to ensure uniform wiring density across multiple dies, transforming the wiring distribution from non-uniform to uniformly dense.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective die selection based on testing, improves die registration, and allows for uniform wiring density across the reconstructed wafer, enhancing manufacturing efficiency and chip functionality.
Implementation Method 1
ensuring precise matching of die and substrate alignment features through crystallographic etching and customized etch processes to form tetragonal pyramids and spikes
Data Source
AI summary
Aspects of the present invention provide a semiconductor structure. The semiconductor structure may include a substrate having a first substrate alignment structure. The semiconductor structure may also include a first die with a first die alignment structure. The first die may be attached to the substrate with the first substrate alignment structure matched to the first die alignment structure.