Embedded Multi-Die Bridge Routing for Smaller Bump Pitches
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Solution Overview
Problem
Current bridge-based designs for electronic packages face limitations in scalability and flexibility, particularly in connecting dies with smaller bump pitches, leading to performance constraints and increased costs due to the need for costly re-designs.
Innovation Solution
Implementing very high density (VHD) routing using a single layer of ultra-fine line-space (uFLS) structures with embedded multi-die interconnect bridges, utilizing lithographic and self-aligned via processes to achieve smaller bump pitches without re-designing the bridge, enabling connections with 40 μm or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If current bridge-based designs are used, then interconnect routing between dies is provided, but scalability and flexibility are limited when connecting dies with smaller bump pitches
Solution Approach 1:
The patent transitions from planar routing to three-dimensional routing by implementing vertical vias through multiple dielectric layers. This allows interconnects to route in the vertical dimension, enabling smaller bump pitches (40 μm or less) without requiring re-design of the bridge structure itself, thus resolving the contradiction between adaptability and manufacturing precision.
Solution Approach 2:
The patent embeds multiple routing layers within nested dielectric layers, with each layer containing conductive interconnects. This nested structure allows dense routing while maintaining the bridge design, enabling scalability to smaller bump pitches without costly re-designs.
2Productivity
If interconnect density is increased to provide faster processing capacity, then processing power increases, but power management and interference issues worsen
Solution Approach 1:
The patent implements ground layers and shielding structures at specific locations within the multi-layer package to locally manage electromagnetic interference and power distribution. This targeted approach allows high interconnect density for increased processing capacity while mitigating power management and interference issues through localized quality control.
3Adaptability or versatility
If bridge structure is re-designed to implement smaller bump pitches, then connectivity to smaller pitch die is enabled, but production cost increases
Solution Approach 1:
The patent creates a universal bridge structure that can accommodate multiple bump pitch configurations (55 μm, 40 μm, and smaller) through the use of multi-layer routing and vertical vias. This single bridge design serves multiple functions and adapts to different die configurations without requiring costly re-designs, resolving the contradiction between adaptability and ease of manufacture.
Data Source
AI summary
A device and method for providing enhanced bridge structures is disclosed. A set of conducting and insulating layers are deposited and lithographically processed. The conducting layers have uFLS routing. A bridge with uFLS contacts and die disposed on the underlying structure such that the die are connected with the uFLS contacts and uFLS routing. For core-based structures, the layers are formed after the bridge is placed on the underlying structure and the die connected to the bridge through intervening conductive layers. For coreless structures, the layers are formed over the bridge and carrier, which is removed prior to bonding the die to the bridge, and the die bonded directly to the bridge.