Multi-Die Cooling Channel Layout for Low-Resistance Fluid Delivery
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Solution Overview
Problem
Existing semiconductor packages face challenges in delivering cooling fluids effectively between multiple substrates or dies due to thermal resistance and limited channel configurations, making it difficult to manage heat extraction efficiently.
Innovation Solution
The implementation of channels and openings that fluidly connect multiple substrates and dies within semiconductor devices, utilizing direct or hybrid bonding interfaces to create sealed pathways for cooling fluids, allowing for customized heat transfer and fluid flow between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If channels are placed near active regions to minimize thermal resistance, then heat extraction efficiency is improved, but it becomes difficult to deliver cooling fluid between multiple substrates or dies
Solution Approach 1:
The cooling system is segmented into multiple independent channels formed in different substrates and dies. Each substrate or die contains its own channel that can be independently configured and optimized, allowing fluid delivery to multiple components without requiring a single complex interconnected system.
Solution Approach 2:
The patent transitions from planar channel arrangements to three-dimensional vertical channels that extend through the thickness of substrates and dies. This dimensional change allows cooling fluid to access active regions on both front and back sides of components, enabling effective heat extraction while simplifying fluid delivery paths.
2Temperature
If channels are formed in each substrate or die for customized cooling, then heat transfer efficiency is improved, but thermal resistance and leakage increase
Solution Approach 1:
A cooling fluid acts as an intermediary medium that flows through channels in multiple substrates and dies. The fluid continuously transfers heat from active regions to external cooling systems, maintaining effective heat removal while the sealed channel structures prevent leakage and minimize thermal resistance at fluid-component interfaces.
Solution Approach 2:
The patent employs sealed channel structures with thin-walled configurations that provide effective thermal coupling between the cooling fluid and active regions while maintaining fluid containment. The sealed nature of these channels prevents leakage, and their thin-walled design minimizes thermal resistance, allowing efficient heat transfer.
3Temperature
If one or more fluids are used for heat transfer, then cooling effectiveness is improved, but device complexity and fluid delivery difficulty increase
Solution Approach 1:
The fluid delivery system is segmented into multiple independent channels distributed across different substrates and dies. Each channel can be independently configured and connected to cooling fluid sources, eliminating the need for a single complex centralized delivery system and simplifying overall fluid distribution.
Solution Approach 2:
The cooling channels are designed with universal characteristics that allow the same basic channel structure to be replicated across multiple substrates and dies. This multi-functional approach enables a single channel design to serve multiple cooling purposes, reducing overall system complexity while maintaining cooling effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation across multiple substrates and dies by minimizing thermal resistance and leakage, enabling efficient cooling of active regions and improving overall thermal management in semiconductor devices.
Implementation Method 1
one or more fluids can be used for heat transfer... By providing channels near the one or more active regions, it is possible to minimize the thermal resistance between heat source and the cooling fluid and provide cooling to the one or more active regions
Data Source
AI summary
Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including a substrate comprising a first channel, a first die coupled to the first substrate and comprising at least a first portion of a second channel, and a first opening extending from the first channel to the second channel.