Multi-Die Semiconductor Package With Overhanging Heat Spreader
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Solution Overview
Problem
The semiconductor industry faces challenges in efficiently integrating multiple components into a single device while maintaining thermal efficiency and performance, as overly tight layouts can compromise thermal efficiency and overall device performance.
Innovation Solution
A semiconductor package design featuring a substrate with conductive patterns, a first semiconductor die, a heat spreader with an overhanging portion, and at least one second semiconductor die thermally and electrically coupled to the heat spreader, encapsulated by an encapsulant layer, which allows for efficient space utilization and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the layout of the package is made tight to improve space efficiency, then the space utilization is improved, but the thermal efficiency deteriorates
Solution Approach 1:
The heat spreader extends beyond the lateral boundaries of the first semiconductor die in the horizontal dimension, creating an overhanging portion that provides additional thermal management area. This dimensional extension allows the heat spreader to serve multiple functions: cooling the first die through direct contact and providing a mounting surface for second dies without increasing the overall package footprint, thus resolving the contradiction between space efficiency and thermal efficiency
Solution Approach 2:
The heat spreader is designed to perform multiple functions simultaneously: it acts as a thermal management component for the first semiconductor die, provides a mounting platform for second semiconductor dies, and serves as a structural element that maintains package integrity. This multi-functionality allows tight integration of multiple components while maintaining adequate thermal pathways
2Adaptability or versatility
If multiple components are integrated into a single device to improve functionality, then the device performance is improved, but the device complexity increases
Solution Approach 1:
Multiple semiconductor dies (first and second dies) are integrated onto a single substrate within a unified package structure. The heat spreader serves as a common platform that combines thermal management and mechanical support functions, while the substrate integrates electrical interconnections. This merging of multiple functional elements into a single package achieves high functionality without proportionally increasing complexity
Solution Approach 2:
The substrate acts as an intermediary element that provides electrical interconnections between the first and second semiconductor dies and external contacts. The heat spreader serves as a mechanical and thermal intermediary that supports multiple dies and facilitates heat transfer. These intermediary components enable complex multi-die integration while maintaining manageable structural organization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances space efficiency, integration density, and heat dissipation, reducing the form factor and mitigating package warpage, while maintaining high performance by arranging multiple dies in parallel rather than series.
Implementation Method 1
a heat spreader mounted over and thermally coupled to the first semiconductor die
Implementation Method 2
an encapsulant layer encapsulating the first semiconductor die, the at least one second semiconductor die, the heat spreader and the conductive patterns on the substrate surface
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes: a substrate having a substrate surface, wherein the substrate includes conductive patterns on the substrate surface; a first semiconductor die attached onto the substrate surface; a heat spreader mounted over and thermally coupled to the first semiconductor die, wherein the heat spreader includes an overhanging portion that extends laterally beyond the first semiconductor die; at least one second semiconductor die attached onto the spreader bottom surface of the overhanging portion and beneath the overhanging portion of the heat spreader, wherein the at least one second semiconductor die is thermally coupled to the overhanging portion of the heat spreader, and is electrically coupled to at least one of the conductive patterns of the substrate; and an encapsulant layer for encapsulating the first semiconductor die, the at least one second semiconductor die, the heat spreader and the conductive patterns on the substrate surface.