Multi-Die IC Assembly with Elastomeric Connector and Compression Fastening
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Solution Overview
Problem
Current computer chip architectures face challenges in efficiently processing large volumes of data required for advanced artificial intelligence and machine learning applications, leading to economic inefficiencies and inadequate data processing capabilities due to limitations in existing semiconductor technologies.
Innovation Solution
An integrated circuit architecture with inter-die connections and an elastomeric connector system that enables direct communication between multiple dies on a single substrate, along with a uniform compression mechanism for secure assembly, addressing connectivity, bandwidth, and thermal expansion mismatch issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple separate computers or servers are used to process large data sets for AI training, then data processing capability is improved, but economic feasibility deteriorates
Solution Approach 1:
The patent divides a single semiconductor substrate into multiple discrete dies, each capable of independent operation. This segmentation allows the system to process large data sets through parallel die operations rather than requiring multiple separate computers, thereby improving data processing capability while avoiding the economic infeasibility of scaling entire server systems.
Solution Approach 2:
The patent combines multiple dies onto a single semiconductor substrate, creating an integrated multi-die system. This merging approach enables high-capacity data processing within a single chip package, eliminating the need to scale out to multiple separate servers while maintaining economic feasibility.
2Quantity of substance
If the number of computers or servers is increased to handle large data volumes, then data processing capacity is improved, but cost-effectiveness deteriorates
Solution Approach 1:
The patent transitions from scaling horizontally (adding more separate servers) to scaling vertically (integrating multiple dies on a single substrate). This dimensional shift in architecture allows the system to achieve high data processing capacity through increased integration density rather than through costly horizontal expansion.
3Productivity
If multiple dies are integrated on a single substrate, then data processing capability is improved, but thermal expansion mismatch issues worsen
Solution Approach 1:
The patent introduces an intermediary layer or structure between the multiple dies and the substrate that mediates thermal expansion differences. This intermediary component absorbs or compensates for differential thermal expansion, preventing reliability issues while maintaining the high data processing capability enabled by multi-die integration.
4Ease of manufacture
If traditional securing methods are used for multi-die assemblies, then assembly simplicity is maintained, but connection reliability deteriorates
Solution Approach 1:
The patent implements preliminary alignment features and pre-positioned connection structures on the semiconductor substrate before die attachment. This preliminary action ensures precise die placement and reliable electrical connections without requiring complex alignment procedures during assembly, thereby maintaining ease of manufacture while improving connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances data processing capabilities, reduces communication latency, and mitigates thermal expansion mismatches, resulting in improved performance and efficiency for large-scale AI and machine learning applications without the need for extensive hardware scaling.
Implementation Method 1
an elastomeric connector arranged between the semiconductor substrate and the electronic circuit substrate
Implementation Method 2
applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components
Data Source
AI summary
Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements.