Multi-Die Isolation Structure for Stable High-Voltage Coupling
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Solution Overview
Problem
Existing multi-die packaging technologies face challenges in achieving stable high and low voltage isolation due to poor coupling performance and inconsistent voltage resistance caused by the use of silicon substrates and organic materials, which are difficult to control and prone to forming holes.
Innovation Solution
A multi-die packaging structure is introduced with an isolation structure that includes an insulating dielectric layer separating conductive layers, using materials like glass or pre-impregnated resin glass fiber cloth to improve isolation and voltage resistance, and incorporating adhesive layers for bonding, thereby forming isolation inductors, capacitors, or transformers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon substrates and organic materials are used for high and low voltage isolation, then the isolation structure can be formed, but the coupling performance is poor and voltage resistance is unstable due to difficulty in controlling thickness uniformity and hole formation
Solution Approach 1:
The patent changes the material parameter from organic materials to insulating dielectric materials (such as glass fiber reinforced plastic plates), which fundamentally alters the thickness uniformity and hole formation characteristics, thereby improving voltage resistance stability without relying on difficult-to-control organic material processing
Solution Approach 2:
The patent uses composite insulating dielectric materials (e.g., glass fiber reinforced plastic) that combine the advantages of different materials to achieve both good electrical insulation and mechanical stability, while maintaining uniform thickness and avoiding hole formation issues associated with pure organic materials
2Reliability
If organic materials are used to connect stacked dies, then the isolator can be formed, but the overall voltage resistance performance is not stable due to hole formation and thickness control difficulties
Solution Approach 1:
The patent changes the material parameter from organic materials to insulating dielectric materials, which have inherently better thickness uniformity and do not form holes during processing, thereby improving voltage resistance performance while simplifying manufacturing control
Solution Approach 2:
The patent adopts insulating dielectric materials that are easier to manufacture and process than organic materials, accepting potential material cost variations in exchange for significantly improved manufacturing ease and product reliability
3Reliability
If silicon substrate is used between conductive layers, then the die structure can be maintained, but the coupling performance of the isolator is poor because silicon is semiconductor material rather than insulating material
Solution Approach 1:
The patent extracts the silicon substrate from the isolation structure and replaces it with dedicated insulating dielectric materials, separating the structural support function from the electrical isolation function, thereby improving coupling performance by ensuring proper electrical insulation between conductive layers
Solution Approach 2:
The patent introduces insulating dielectric materials as intermediary layers between conductive layers, which provide proper electrical insulation and improve coupling performance without requiring complex isolation structure designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the coupling performance and voltage resistance of the isolator, reduces manufacturing complexity, and lowers production costs while improving yield and service life of the packaging structure.
Implementation Method 1
The first conductive layer in the isolation structure is separated from the second conductive layer in the first die by an insulating dielectric layer in the isolation structure
Implementation Method 2
an adhesive layer located below the insulating dielectric layer
Implementation Method 3
at least one of the first conductive layer in the isolation structure and the second conductive layer in the first die forms at least one of an isolation inductor, isolation capacitor, or an isolation transformer
Data Source
AI summary
A multi-die packaging structure includes: a first die, comprising at least a second conductive layer; a second core; and an isolation structure, located on the first die and electrically connected to the second die, wherein the isolation structure comprises: an insulating dielectric layer; the first conductive layer located above the insulating dielectric layer; and an adhesive layer located below the insulating dielectric layer, the first conductive layer in the isolation structure and the second conductive layers in the first die forms at least one of the isolation inductance, isolation capacitor, and isolation transformer. By setting an isolation structure electrically connected to the second die on the first die, the first conductive layer in the isolation structure is separated from the second conductive layer in the first die by an insulating dielectric layer in the isolation structure.