Multi-Die Memory Identification via Electrical Counting
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Solution Overview
Problem
Conventional bonding difference methods are infeasible for identifying individual memory devices in multi-die memory apparatuses, particularly in 3D integrated circuit packaging technologies like through-silicon-via (TSV) where memory devices are vertically stacked and all pads are connected similarly.
Innovation Solution
A method where a controller sends initial and start commands to memory devices to generate and compare target numbers, determining the first time-up memory device through counting actions, allowing for the setting of identification codes without requiring a special bonding structure, enabling each memory device to be identified for access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If bonding difference method is used to identify memory devices, then individual memory device identification is achieved, but it becomes infeasible for 3D integrated circuit packaging with vertically stacked memory devices where all pads are connected similarly
Solution Approach 1:
The patent replaces the mechanical/bonding-based identification method with an electrical/software-based identification method. Instead of relying on physical bonding differences, the system uses a controller to send identification commands and memory devices to generate and compare target numbers through counting operations, thereby identifying individual devices through electrical signals and logical operations rather than physical bonding variations.
Solution Approach 2:
The patent changes the identification parameter from physical bonding characteristics to electrical counting results. Each memory device generates target numbers by performing counting operations based on identification commands, and the controller identifies devices by comparing these generated target numbers, thus shifting the identification basis from physical structure to electrical parameter variation.
2Reliability
If conventional bonding identification method is applied, then memory device individuality is recognized, but it requires special bonding structures that complicate the packaging process
Solution Approach 1:
The patent eliminates the need for complex mechanical bonding structures by substituting them with an electrical identification system. The controller sends identification initial commands and start commands, memory devices perform counting operations to generate target numbers, and comparison is done electrically, thereby achieving reliable identification without requiring special bonding structures.
Solution Approach 2:
Each memory device autonomously generates its own target number by performing counting operations internally when receiving identification commands from the controller. This self-service mechanism allows devices to identify themselves without requiring external bonding structures or assistance, simplifying the overall system architecture.
Data Source
AI summary
A multi-die memory apparatus and identification method thereof are provided. The identification method includes: sending an identification initial command and a first start command to a plurality of memory devices by a controller for starting a first identification period; respectively generating a plurality of first target numbers by the memory devices; respectively performing first counting actions and comparing a plurality of first counting numbers with the first target numbers by a plurality of un-identified memory devices to set a first time-up memory device of the memory devices; and, setting an identification code of the first time-up memory device of the un-identified memory devices to be a first value.