Multi-Die MEMS Package With Through Silicon Vias

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Solution Overview

Problem

The use of separate controllers for each microelectromechanical system (MEMS) chip in multi-MEMS applications leads to increased power consumption, silicon usage, engineering resources, and costs, particularly for MEMS requiring high voltage signals, which are expensive and not fully standardized.

Innovation Solution

A multi-die MEMS package is proposed, where a controller integrated circuit (IC) with through silicon vias (TSVs) integrates multiple MEMS ICs, eliminating the need for separate controllers and high voltage ASICs by providing both low and high voltage circuitry, and using TSVs to reduce package footprint and stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate controllers are used for each MEMS chip, then each MEMS device can be independently controlled, but power consumption and silicon usage increase significantly

Engineering Contradiction:

ImproveIndependent control capabilityVSAvoidPower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The patent combines multiple MEMS devices (inertial sensor, pressure sensor, etc.) under a single controller IC, eliminating the need for separate controllers for each MEMS chip. This consolidation reduces the total number of controllers, thereby reducing power consumption and silicon usage while maintaining independent control capability through integrated control circuitry.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The controller IC is designed with multi-functional capability to control different types of MEMS devices (inertial sensors, pressure sensors, etc.) that previously required dedicated separate controllers. This universal controller approach reduces overall system power consumption while maintaining the adaptability to independently control each MEMS device type.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If separate controllers are used for each MEMS chip, then each device can be independently controlled, but the system size and cost increase

Engineering Contradiction:

ImproveIndependent control capabilityVSAvoidSystem size

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges multiple separate controller devices into a single integrated controller IC that can control multiple MEMS devices. This consolidation reduces system size and complexity by eliminating redundant controller components while maintaining the capability to independently control each MEMS device through integrated control circuitry.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If high voltage ASICs are used for MEMS requiring high voltage signals, then the MEMS can operate at required voltages, but manufacturing costs increase significantly

Engineering Contradiction:

ImproveHigh voltage operation capabilityVSAvoidManufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines high voltage and low voltage circuitry within a single controller IC, eliminating the need for separate expensive high voltage ASICs. This integration reduces manufacturing costs while maintaining the capability to provide high voltage signals to MEMS devices that require them.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The controller IC is designed with universal voltage handling capability, incorporating both high voltage and low voltage circuitry to serve multiple MEMS devices with different voltage requirements. This multi-functional approach eliminates the need for separate high voltage ASICs, significantly reducing manufacturing costs while maintaining reliable high voltage operation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Adaptability or versatility

If multiple separate controllers are used, then each MEMS device has dedicated control, but engineering resources and production costs multiply

Engineering Contradiction:

ImproveDedicated controlVSAvoidEngineering resources

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent merges the control functions for multiple MEMS devices into a single controller IC, reducing the number of engineering resources required for design, testing, and production. This consolidation maintains dedicated control capability for each MEMS device while significantly reducing the multiplicative effect on engineering resources and production costs.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentEP2616389B1Multi-die MEMS package

Publication Date: 2017.04.05 FAIRCHILD SEMICON CORP

AI summary

This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.