Multi-Die Semiconductor Package With Direct-Contact Heat Dissipation
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Solution Overview
Problem
As electronic products are miniaturized, heat dissipation in semiconductor packages becomes a critical issue, particularly for multi-die packages where die arrangement and connecting elements impact data transmission speed and reliability.
Innovation Solution
The manufacturing method involves placing semiconductor dies on a carrier, forming a molding compound, and creating a redistribution structure. A heat dissipation module is then applied directly to the back sides of the dies and molding compound, with an adhesive material filling the gap between the heat dissipation module and the molding compound.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor dies are miniaturized to reduce product size, then product size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments: (1) heat dissipation protrusions on the first substrate, (2) a separate heat dissipation module, and (3) thermal interface material. This segmentation allows heat to be dissipated through multiple pathways and surfaces, effectively managing heat in miniaturized packages where conventional single-point heat sinks are insufficient.
Solution Approach 2:
The patent transitions from conventional planar heat dissipation to three-dimensional heat dissipation by adding vertical heat dissipation protrusions that extend from the substrate surface. This dimensional change increases the heat dissipation surface area without increasing the planar footprint, enabling effective heat management in miniaturized electronic products.
2Speed
If multiple semiconductor dies are arranged closely to improve data transmission speed, then data transmission speed is improved, but reliability decreases due to heat accumulation and mechanical stress
Solution Approach 1:
The patent applies local quality by providing heat dissipation protrusions at specific locations corresponding to heat-generating components, and using thermal interface material selectively in critical thermal zones. This localized approach ensures that heat is dissipated where it is most needed, maintaining reliability in multi-die arrangements with close spacing for high-speed data transmission.
Solution Approach 2:
The patent introduces thermal interface material as an intermediary substance between the heat dissipation protrusions and the heat-generating semiconductor dies. This intermediary enhances thermal coupling and heat transfer efficiency, allowing reliable operation of closely-spaced multi-die packages by effectively managing heat accumulation.
3Temperature
If a heat dissipation module is added to improve heat dissipation, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation module with the existing substrate structure by integrating heat dissipation protrusions directly onto the first substrate. This merging approach combines thermal management functionality with the mechanical support structure, improving heat dissipation without proportionally increasing overall device complexity.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the semiconductor dies, electrical connections through conductive pads, and heat dissipation through integrated protrusions. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby improving thermal management while limiting increases in device complexity.
4Temperature
If adhesive material is used to fill gaps between heat dissipation module and molding compound, then heat dissipation and mechanical strength are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes the adhesive material's viscosity as a controllable parameter to enable self-leveling and gap-filling behavior. By selecting adhesive material with appropriate rheological properties, the system accommodates variations in manufacturing tolerances while ensuring complete gap filling and maintaining consistent thermal and mechanical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient heat dissipation and improved data transmission speed among semiconductor dies, while also enhancing mechanical strength and reducing warpage during the singulation process, thus addressing the challenges of heat dissipation and die arrangement in miniaturized electronic products.
Implementation Method 1
an adhesive material filling the gap between the heat dissipation module and the molding compound
Implementation Method 2
A heat dissipation module is then applied directly to the back sides of the dies
Data Source
AI summary
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.