Multi-Die Semiconductor Package With Direct-Contact Heat Spreader

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Solution Overview

Problem

As electronic products are miniaturized, heat dissipation in semiconductor packages becomes a critical issue, particularly in multi-die packages, where the arrangement of dies and connecting elements affects data transmission speed and reliability.

Innovation Solution

A manufacturing method for semiconductor packages involves placing semiconductor dies on a carrier with an adhesive layer, forming a molding compound, and creating a redistribution structure, followed by the formation of a heat dissipation module with a thermal interfacial pattern and heat spreader, which allows direct contact with the dies for efficient heat dissipation and improved data transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If semiconductor dies are arranged in multi-die packages to improve functionality, then device functionality is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improvedevice functionalityVSAvoidheat dissipation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent introduces through-holes penetrating the substrate to divide and conduct heat away from the multi-die package region, segmenting the heat flow path through multiple vertical channels in the substrate

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses conductive adhesive material as an intermediary substance filled in the through-holes to facilitate heat transfer from the multi-die package to the heat dissipation structure, enabling efficient thermal conduction through the substrate

Inventive Principle:

Principle #24Intermediary (Mediator)

2Speed

If complex arrangements of dies and connecting elements are used to improve data transmission speed, then data transmission speed is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvedata transmission speedVSAvoidarrangement of dies and connecting elements

Core Design Contradiction:

SpeedVSDevice complexity

Solution Approach 1:

The substrate serves multiple functions simultaneously: it provides mechanical support for the dies, establishes electrical connections through conductive adhesive, and acts as a heat dissipation structure through the filled through-holes, reducing the need for separate components

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the connection function and heat dissipation function into a single integrated structure by filling through-holes with conductive adhesive material that simultaneously provides electrical connection and thermal conduction pathways

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If heat dissipation structures are added to improve thermal management, then heat dissipation is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidheat dissipation structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent transitions from planar heat dissipation to three-dimensional heat dissipation by creating vertical through-holes penetrating the substrate, adding a vertical dimension to the heat conduction pathways

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent changes the physical state and properties of the adhesive material by filling it into through-holes, transforming it from a simple bonding agent to a multi-functional material that provides both mechanical connection and thermal conduction with controlled conductivity

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables efficient heat dissipation and enhanced mechanical strength, reducing warpage and delamination issues during singulation, while improving data transmission speed among semiconductor dies.

Implementation Method 1

a thermal interfacial pattern formed on the back sides of the first and second semiconductor dies and the molding compound

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat spreader provided on the thermal interfacial pattern

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12165946B2Semiconductor package and manufacturing method thereof

Publication Date: 2024.12.10 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.