Multi-Die Package Layout With RDL for Compact Interconnects
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving compact and efficient packaging of integrated circuits due to the increasing complexity and size constraints of electronic components, where existing packaging methods struggle to effectively integrate multiple dies and provide reliable electrical connections while maintaining a small form factor.
Innovation Solution
The method involves forming a semiconductor package with a first and second die disposed side by side, a third die flip-chip bonded between them, and an encapsulant that laterally encapsulates all three, along with a redistribution layer structure, utilizing conductive vias and connectors for electrical connections, and an immersion molding process for uniform encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple dies are integrated into a smaller package area, then integration density is improved, but manufacturing complexity increases
Solution Approach 1:
The package is segmented into multiple functional layers including a substrate, multiple dies (first die, second die, third die), an encapsulant, and a redistribution layer structure. This segmentation allows each component to be optimized independently while achieving high integration density through vertical stacking and side-by-side arrangement of dies.
Solution Approach 2:
The patent transitions from traditional planar packaging to a three-dimensional architecture by stacking dies vertically (first die and second die side by side on substrate, third die on encapsulant) and creating multiple interconnection layers through the redistribution layer structure. This dimensional transition enables higher integration density within a compact footprint.
2Area of stationary object
If compact package design is implemented, then area utilization is improved, but electrical connection reliability deteriorates
Solution Approach 1:
Electrical connections are extended into the vertical dimension through the redistribution layer structure with multiple conductive layers and vias. This allows signals to be routed through multiple levels (first conductive layer, second conductive layer, third conductive layer) rather than relying solely on planar traces, improving connection reliability in compact packages.
Solution Approach 2:
The redistribution layer structure acts as an intermediary between the dies and external connections. It provides multiple conductive paths and routing options, enabling reliable electrical connections while accommodating the compact three-dimensional die arrangement. The encapsulant also serves as an intermediary protective layer.
3Reliability
If multiple connection layers are added for reliable electrical connections, then connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The redistribution layer structure merges multiple functions into a single integrated component: it provides electrical interconnection between dies, serves as a mechanical support structure, enables signal routing through multiple conductive layers, and works with the encapsulant for protection. This consolidation achieves reliable connections while managing structural complexity through functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a compact, high-throughput, and cost-effective packaging solution that efficiently integrates multiple dies with reliable electrical connections, suitable for small package forms and high integration density, enhancing the yield and reducing costs.
Implementation Method 1
an immersion molding process for uniform encapsulation
Data Source
AI summary
A package and a method of manufacturing the same are provided. The package includes a first die, a second die, a third die, an encapsulant, and a redistribution layer (RDL) structure. The first die and the second die are disposed side by side. The third die is disposed on the first die and the second die to electrically connect the first die and the second die. The encapsulant laterally encapsulates the first die, the second die, and the third die and fills in a gap between the first die, the second die, and the third die. The RDL structure is disposed on the third die and the encapsulant.