Multi-Die Channel Layout Using 180° Rotation for Pad Alignment

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Solution Overview

Problem

The challenge in semiconductor technology is that multiple dies manufactured according to the same design cannot be stacked effectively due to mismatched substrate and die pad arrangements, leading to difficulties in forming electrical connections and precise signal transfer.

Innovation Solution

The semiconductor apparatus includes a substrate with specifically arranged byte pads and dies that are rotated by 180 degrees relative to each other, allowing for effective coupling and data transfer between channels, enabling efficient stacking and operation of multiple dies within a single package.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple dies are packaged into a single package to improve storage capacity and data processing speed, then the productivity and performance of the semiconductor apparatus are improved, but the manufacturing complexity increases due to mismatched substrate and die pad arrangements

Engineering Contradiction:

Improvestorage capacity and data processing speedVSAvoidmanufacturing complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent applies asymmetry by rotating the second die 180 degrees relative to the first die, creating an asymmetric arrangement that allows pad arrangements on identical dies to match the substrate pad layout. This rotational transformation enables proper electrical connections without requiring different die designs, thus reducing manufacturing complexity while maintaining multi-channel functionality.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent uses inversion by rotating the second die 180 degrees, effectively turning it upside down relative to the first die. This inversion transforms the pad arrangement orientation, allowing the otherwise mismatched pad layouts to align properly with the substrate pads, thereby enabling successful packaging of multiple identical dies.

Inventive Principle:

Principle #13The other way round (Inversion)

2Volume of moving object

If multiple dies are stacked to improve storage capacity, then the volume efficiency is improved, but the ease of manufacture deteriorates due to inability to stack identical dies

Engineering Contradiction:

Improvestorage capacityVSAvoidease of stacking

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

By introducing 180-degree rotational asymmetry for the second die, the patent enables identical dies to be stacked successfully. The asymmetric orientation transforms the pad arrangement to match the substrate, allowing multiple identical dies to be manufactured and stacked without requiring individual customization, thus improving ease of manufacture while maintaining volume efficiency.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The 180-degree rotation inverts the orientation of the second die, transforming its pad layout to complement the substrate arrangement. This inversion enables identical dies to be stacked vertically or in parallel configurations, significantly improving manufacturability while achieving high storage capacity through multi-die integration.

Inventive Principle:

Principle #13The other way round (Inversion)

3Productivity

If dies are manufactured according to the same design to improve yield and reduce cost, then the manufacturing efficiency is improved, but the adaptability to substrate pad arrangements deteriorates

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidadaptability to substrate pad arrangements

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent applies inversion by rotating the second die 180 degrees, which transforms the pad arrangement orientation to match the substrate layout. This allows identical dies manufactured with the same design to be adapted to the substrate's pad arrangement through rotational transformation, maintaining manufacturing efficiency while achieving compatibility with the substrate configuration.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent changes the orientation parameter (rotation angle) of the second die by 180 degrees, transforming its spatial configuration to match the substrate pad arrangement. This parameter change enables identical dies to be adapted to the substrate without modifying the die design itself, thus preserving manufacturing efficiency while achieving adaptability.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS12026399B2Semiconductor apparatus including a plurality of dies operating as a plurality of channels

Publication Date: 2024.07.02 SK HYNIX INC

AI summary

A semiconductor apparatus includes a substrate, a first die, and a second die. The substrate includes first and second byte pads of a first channel and first and second byte pad of a second channel. First byte pads of the first die are respectively coupled to the first byte pads of the first channel, and second byte pads of the first die are respectively coupled to the second byte pads of the first channel. The second die, as disposed, is rotated by 180° with respect to the first die. First byte pads of the second die are respectively coupled to the second byte pads of the second channel, and second byte pads of the second die are respectively coupled to the first byte pads of the second channel.