Multi-Die Package Power Segmentation for Current Reduction
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Solution Overview
Problem
In multi-die packages, the non-select chip consumes unnecessary current due to the application of active power when controlled by a common chip selecting signal, leading to inefficient operation.
Innovation Solution
A multi-die packaged device with separate power supply circuits for active and standby modes, where the non-select chip receives a second power specifically for operation control, allowing it to operate correctly without errors during concurrent operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a common chip selecting signal is used to control multiple dice, then the control structure is simplified, but active power is applied to non-select chips causing unnecessary current consumption
Solution Approach 1:
The power supply is segmented into two independent circuits: a first power supply circuit that provides active power to all dice, and a second power supply circuit that provides standby power selectively to non-selected dice. This segmentation allows the non-selected dice to receive only minimal necessary power for logic circuit operation, thereby reducing unnecessary current consumption while maintaining simplified control structure.
Solution Approach 2:
Different power supply conditions are applied to different dice based on their selection state. Selected dice receive full active power from the first power supply circuit, while non-selected dice receive only standby power from the second power supply circuit. This local differentiation of power quality enables reduced current consumption in non-selected dice without affecting the operation of selected dice.
2Ease of operation
If active power is applied to non-select chips for concurrent operation, then operation control is enabled, but current consumption increases
Solution Approach 1:
Instead of applying full active power to non-selected dice, the system applies only partial power (standby power) through the second power supply circuit. This standby power is sufficient to maintain logic circuit operation for sensing chip selecting signals and preparing for concurrent operations, but excessive enough to enable operational readiness without full power consumption.
Solution Approach 2:
The logic circuits in non-selected dice are maintained in a state where they can autonomously sense chip selecting signals and prepare for operation using only standby power. When a chip selecting signal is detected, these circuits can self-activate without requiring external intervention or full power application, enabling efficient operation control with minimal power consumption.
Data Source
AI summary
A packaged multi die device includes at least one memory die. The one or more of the memory dice includes a memory function circuit configured to program or read data, a logic circuit configured to control the program operation and the read operation of the memory function circuit in accordance with an inputted operation command, and a power supplying circuit configured to provide a power corresponding to an operation mode to the memory function circuit, and apply an extra power to the logic circuit.


