Multi-Die Voltage Regulator Packaging for Low IR Drop
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Solution Overview
Problem
Existing semiconductor packages face significant IR drop issues due to the need for additional interconnect structures when voltage regulators are formed on the same die as active circuits or require feedback signals, which complicates power delivery and stability.
Innovation Solution
A semiconductor package design with a voltage regulator disposed on a separate die that directly senses the power supply level, allowing for regulated power distribution without additional interconnect structures, thereby minimizing IR drop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If voltage regulator is formed on the same die as active circuits, then integration density is improved, but IR drop increases due to additional interconnect structures
Solution Approach 1:
The patent segments the voltage regulator and active circuits onto separate dies. The voltage regulator die and active circuits die are bonded together through wafer-level bonding, allowing the voltage regulator to be physically separated from the active circuits while maintaining electrical connection. This segmentation eliminates the need for additional interconnect structures within the same die, thereby reducing IR drop while preserving integration benefits.
Solution Approach 2:
The patent introduces a bonding interface as an intermediary between the voltage regulator die and active circuits die. This bonding interface provides direct electrical connection without requiring additional interconnect structures, serving as a mediator that enables low-IR-drop power delivery while maintaining physical separation of components.
2Reliability
If voltage regulator requires feedback signals from load circuit, then power regulation stability is improved, but device complexity increases due to additional interconnect structures
Solution Approach 1:
The patent segments the feedback signal path to travel through the bonding interface between separate dies. The load circuit on one die provides feedback signals that are transmitted through the bonding interface to the voltage regulator on another die. This segmentation maintains the feedback mechanism for stability while avoiding complex interconnect structures within a single die.
Solution Approach 2:
The bonding interface serves as an intermediary that carries feedback signals between the load circuit and voltage regulator. This intermediary provides a direct electrical path for feedback signals without requiring additional complex interconnect structures, maintaining regulation stability while simplifying the overall device architecture.
Data Source
AI summary
A semiconductor package includes a first die comprising a voltage regulator that has a first input and a second input. The semiconductor package includes a second die coupled to the first die and comprising a first load circuit. The voltage regulator is configured to provide a regulated voltage to the first load circuit through a first through via structure based on a first voltage received through the first input and a second voltage received from the first load circuit through a second through via structure. The first voltage is a constant reference voltage, and the second voltage is a first signal sensed from the first load circuit.