Multi-Die Semiconductor Package with Penetrated Opening Substrate
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Solution Overview
Problem
Existing semiconductor packages face limitations in forming compact, multi die stacked structures with sufficient structural and thermal stability, and struggle to effectively shield electromagnetic interference (EMI) and improve heat radiation performance.
Innovation Solution
A semiconductor package design featuring a first substrate with separated pads and leads, bonded semiconductor devices, a second substrate with penetrated opening units for electrical connection, and a package housing that includes insulating and metal layers for enhanced conductivity and thermal management, utilizing materials like Cu and Al for the substrate and Au, Ag, or Cu for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a multi die stacked structure is formed using wire connection, then electrical connection between packages is achieved, but structural stability and thermal stability are insufficient
Solution Approach 1:
A substrate is introduced as an intermediary component between the first and second packages. The substrate provides a stable platform with integrated pads and leads that enable both electrical connection and mechanical support, resolving the instability issue of direct wire connections while maintaining ease of manufacture.
Solution Approach 2:
The substrate is formed as a composite structure including a lead frame with multiple materials (e.g., Cu or Al for conductivity, insulating materials for isolation). This composite construction simultaneously provides electrical connectivity, thermal management, and structural stability, addressing all three requirements.
2Volume of moving object
If a compact multi die structure is formed, then package size is reduced, but EMI shielding and heat radiation performance deteriorate
Solution Approach 1:
The substrate design incorporates local quality variations: conductive pads and leads in specific areas for electrical connection, insulating regions for EMI shielding, and thermally conductive pathways for heat radiation. This allows the compact package to maintain performance by optimizing local properties rather than requiring uniform structure throughout.
Solution Approach 2:
The lead frame structure extends in multiple dimensions (planar layout with vertical connections), allowing compact footprint while maintaining EMI shielding through strategic placement of conductive elements and heat radiation pathways in different spatial dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact multi die structure with improved EMI shielding and heat radiation performance, suitable for small-sized semiconductor packages, by optimizing the size and shape of penetrated opening units and using conductive materials for efficient electrical and thermal conductivity.
Implementation Method 1
electrical connection parts electrically connecting the at least one semiconductor device with the second substrate
Implementation Method 2
The first substrate may be a lead frame formed of a metal and the metal may include 50% or more of Cu or 40% or more of Al
Data Source
AI summary
Provided is a semiconductor package including: at least two pads, a first substrate, at least two semiconductor devices, a second substrate, an electrical connection part, and a package housing, wherein the at least two pads are electrically or structurally separated from each other, the first substrate is formed of leads spaced apart from the pads, the at least two semiconductor devices are bonded on each of the pads, the second substrate is formed on and spaced apart from the upper parts of the semiconductor devices, is placed on and electrically connected to the at least one lead of the first substrate, and includes at least one penetrated opening unit on an area facing the at least one semiconductor device, the electrical connection part electrically connects the at least one semiconductor device with the second substrate, and the package housing covers the semiconductor devices and the electrical connection part. Accordingly, the semiconductor package has a multi die structure and is compact. Also, a shielding performance of electromagnetic interference (EMI) and a heat radiation performance are improved in the semiconductor package.