Multi-Die Temperature Sensor Trimming for Accurate GaN Calibration
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Solution Overview
Problem
Existing methods for integrating and calibrating temperature sensors in multi-chip modules, particularly with integrated circuit dies like GaN, face challenges due to insufficient accuracy and functionality to host memory for calibration, leading to unreliable temperature measurements.
Innovation Solution
The implementation of a system that includes a first and second temperature sensor, calibrator, and indicator, where the second temperature sensor is coupled to the second integrated circuit die via a switch controller and calibration equipment, allowing for accurate temperature measurement and calibration, even in dies without native calibration capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If temperature sensors are integrated directly into GaN integrated circuit dies, then integration density and performance are improved, but measurement accuracy deteriorates due to insufficient calibration functionality
Solution Approach 1:
The system divides the temperature measurement function into separate components: temperature sensors integrated into individual GaN dies, and external calibration equipment that interfaces with multiple dies. This segmentation allows each die to maintain its native temperature sensing capability while external equipment provides the calibration functionality that GaN dies lack.
Solution Approach 2:
External calibration equipment serves as an intermediary between the temperature sensors on GaN dies and the calibration process. This intermediary provides the necessary calibration functionality that cannot be hosted natively on the GaN dies, enabling accurate temperature measurements without compromising integration density.
2Measurement precision
If calibration functionality is integrated into each temperature sensor, then measurement accuracy is improved, but device complexity increases due to additional components required in each die
Solution Approach 1:
The external calibration equipment is designed to interface with multiple temperature sensors across different integrated circuit dies, providing universal calibration capability. This multi-functional approach eliminates the need for dedicated calibration components in each individual die, reducing device complexity while maintaining measurement accuracy.
Solution Approach 2:
By placing calibration functionality in external equipment rather than within each temperature sensor, the system uses an intermediary approach that simplifies the sensor structure. The external calibrator acts as a separate entity that can service multiple sensors without adding complexity to each individual sensor or die.
3Adaptability or versatility
If multiple temperature sensors are used across different integrated circuit dies, then measurement coverage is improved, but calibration difficulty increases due to varying temperature characteristics
Solution Approach 1:
The external calibration equipment implements feedback mechanisms to measure and adjust for varying temperature characteristics across different integrated circuit dies. By continuously monitoring temperature readings and comparing them against reference values, the system can automatically compensate for die-to-die variations, simplifying the calibration process while maintaining broad measurement coverage.
Solution Approach 2:
The calibration system adjusts calibration parameters dynamically based on the specific characteristics of each integrated circuit die. By changing calibration parameters such as offset values, gain factors, or reference temperatures according to each die's unique thermal properties, the system can accurately calibrate multiple sensors across different dies without requiring complex manual calibration procedures.
Data Source
AI summary
Methods, apparatus, systems and articles of manufacture to trim temperature sensors are disclosed. An example method includes: sampling a first value indicative of a temperature of a first die of a multi-chip module (MCM) with a first temperature sensor, the first die including a first transistor having a channel including a first material; and calibrating a second temperature sensor configured to sample a second value indicative of a temperature of a second die including a second transistor have a second channel including a second material, the calibrating based on the first value.